发明授权
US08627566B2 Method for packaging a microelectromechanical system (MEMS) device
有权
用于封装微机电系统（MEMS）装置的方法
- 专利标题： Method for packaging a microelectromechanical system (MEMS) device
- 专利标题（中）： 用于封装微机电系统（MEMS）装置的方法
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申请号： US12752363申请日： 2010-04-01
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公开(公告)号： US08627566B2公开(公告)日： 2014-01-14
- 发明人: Moody K. Forgey , Mark A. Kressley
- 申请人： Moody K. Forgey , Mark A. Kressley
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 代理商 Warren L. Franz; Wade J. Brady, III; Frederick J. Telecky, Jr.
- 主分类号： B21D53/84
- IPC分类号： B21D53/84
摘要：
A ceramic header configured to form a portion of an electronic device package includes a mounting portion configured to provide a mounting surface for an electronic device. In addition, the ceramic header includes one or more conductive input-output connectors operable to provide electrical connections from a first surface of the ceramic header to a second surface of the ceramic header. The ceramic header also includes one or more thermally polished surfaces.
公开/授权文献
- US20100188729A1 Ceramic Header Method and System 公开/授权日：2010-07-29
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