发明授权
- 专利标题： System and method for providing the capability of peeling thin polymer films from a substrate
- 专利标题（中）： 提供从基板剥离薄聚合物膜的能力的系统和方法
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申请号： US12443141申请日： 2007-09-28
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公开(公告)号： US08628714B2公开(公告)日： 2014-01-14
- 发明人: Sriram Krishnan , Sanjay Sarma
- 申请人： Sriram Krishnan , Sanjay Sarma
- 申请人地址： US MA Cambridge
- 专利权人： Massachusetts Institute of Technology
- 当前专利权人： Massachusetts Institute of Technology
- 当前专利权人地址： US MA Cambridge
- 代理机构： Sheehan Phinney Bass + Green PA
- 代理商 Peter A. Nieves
- 国际申请： PCT/US2007/020940 WO 20070928
- 国际公布： WO2008/060358 WO 20080522
- 主分类号： B29C41/42
- IPC分类号： B29C41/42
摘要：
A system and method for providing the capability of peeling thin polymer films from a substrate is provided. Generally, the method contains the steps of: providing a substrate having a top surface and a bottom surface; placing a peel initiator on the top surface; applying a polymer on the top surface of the substrate and a top surface of the peel initiator; curing the polymer, resulting in a thin-polymer film; and peeling the peel initiator from the substrate, thereby removing the thin-polymer film from the top surface of the substrate.
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