- 专利标题: Semiconductor device and manufacturing method thereof
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申请号: US12683681申请日: 2010-01-07
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公开(公告)号: US08629432B2公开(公告)日: 2014-01-14
- 发明人: Junichiro Sakata , Takashi Shimazu , Hiroki Ohara , Toshinari Sasaki , Shunpei Yamazaki
- 申请人: Junichiro Sakata , Takashi Shimazu , Hiroki Ohara , Toshinari Sasaki , Shunpei Yamazaki
- 申请人地址: JP Atsugi-shi, Kanagawa-ken
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Atsugi-shi, Kanagawa-ken
- 代理机构: Robinson Intellectual Property Law Office, P.C.
- 代理商 Eric J. Robinson
- 优先权: JP2009-008134 20090116
- 主分类号: H01L29/786
- IPC分类号: H01L29/786 ; H01L21/36
摘要:
A semiconductor device including a thin film transistor which includes an oxide semiconductor layer and has high electric characteristics and reliability. Film deposition is performed using an oxide semiconductor target containing an insulator (an insulating oxide, an insulating nitride, silicon oxynitride, aluminum oxynitride, or the like), typically SiO2, so that the semiconductor device in which the Si-element concentration in the thickness direction of the oxide semiconductor layer has a gradient which increases in accordance with an increase in a distance from a gate electrode is realized.
公开/授权文献
- US20100181565A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 公开/授权日:2010-07-22
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