Invention Grant
US08631759B2 System and method for depositing thin layers on non-planar substrates by stamping
有权
通过冲压在非平面基板上沉积薄层的系统和方法
- Patent Title: System and method for depositing thin layers on non-planar substrates by stamping
- Patent Title (中): 通过冲压在非平面基板上沉积薄层的系统和方法
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Application No.: US12697357Application Date: 2010-02-01
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Publication No.: US08631759B2Publication Date: 2014-01-21
- Inventor: Stephen Forrest , Xin Xu , Xiangfei Qi , Marcelo Davanco
- Applicant: Stephen Forrest , Xin Xu , Xiangfei Qi , Marcelo Davanco
- Applicant Address: US NJ Princeton US MI Ann Arbor
- Assignee: The Trustees Of Princeton University,The Regents Of The University Of Michigan
- Current Assignee: The Trustees Of Princeton University,The Regents Of The University Of Michigan
- Current Assignee Address: US NJ Princeton US MI Ann Arbor
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: B05C1/00
- IPC: B05C1/00 ; B05C11/00 ; C23C14/00
Abstract:
An elastomeric stamp is used to deposit material on a non-planar substrate. A vacuum mold is used to deform the elastomeric stamp and pressure is applied to transfer material from the stamp to the substrate. By decreasing the vacuum applied by the vacuum mold, the elasticity of the stamp may be used to apply this pressure. Pressure also may be applied by applying a force to the substrate and/or the stamp. The use of an elastomeric stamp allows for patterned layers to be deposited on a non-planar substrate with reduced chance of damage to the patterned layer.
Public/Granted literature
- US20100189837A1 System and Method for Depositing Thin Layers on Non-Planar Substrates by Stamping Public/Granted day:2010-07-29
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