发明授权
- 专利标题： Soldering pad
- 专利标题（中）： 焊盘
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申请号： US13217626申请日： 2011-08-25
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公开(公告)号： US08633401B2公开(公告)日： 2014-01-21
- 发明人: Hua-Li Zhou , Chia-Nan Pai , Shou-Kuo Hsu
- 申请人： Hua-Li Zhou , Chia-Nan Pai , Shou-Kuo Hsu
- 申请人地址： CN Shenzhen TW New Taipei
- 专利权人： Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人： Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址： CN Shenzhen TW New Taipei
- 代理机构： Altis Law Group, Inc.
- 优先权： CN201110106783 20110427
- 主分类号： H05K1/11
- IPC分类号： H05K1/11
摘要：
A pad includes a first mating section and a second mating section. The first mating section includes a first horizontal plane and a first inclined plane. The second mating section includes a second horizontal plane and a second inclined plane. The first mating section is a copper foil capable of being connected to a wire. The second mating section is made of insulating material. The first inclined plane and the second inclined plane are bonded together.
公开/授权文献
- US20120273254A1 SOLDERING PAD 公开/授权日：2012-11-01
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