Invention Grant
- Patent Title: Defect inspection device and defect inspection method
- Patent Title (中): 缺陷检查装置和缺陷检查方法
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Application No.: US12992903Application Date: 2009-05-13
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Publication No.: US08634069B2Publication Date: 2014-01-21
- Inventor: Hiroyuki Nakano , Shunji Maeda , Toshihiko Nakata
- Applicant: Hiroyuki Nakano , Shunji Maeda , Toshihiko Nakata
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2008-129314 20080516
- International Application: PCT/JP2009/002083 WO 20090513
- International Announcement: WO2009/139155 WO 20091119
- Main IPC: G01N21/88
- IPC: G01N21/88

Abstract:
A defect inspection device, which inspects defects such as foreign materials existing on a specimen on which a circuit pattern of wiring or the like is formed, is provided with an illumination optical system which illuminates a plurality of different areas the specimen with a plurality of linear shaped beams and an image forming optical system that forms images of the plurality of the illuminated areas on a plurality of detectors, and the detectors are configured to receive a plurality of polarization components substantially at the same time and individually, wherein the polarization components are different from each other and are contained in each of the plurality of the optical images formed by the image forming optical system, thereby detecting a plurality of signals corresponding to the polarization components and carrying out the inspection at high speed under a plurality of optical conditions.
Public/Granted literature
- US20110149275A1 DEFECT INSPECTION DEVICE AND DEFECT INSPECTION METHOD Public/Granted day:2011-06-23
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