Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
- Patent Title (中): 液体喷头和液体喷射装置
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Application No.: US13075142Application Date: 2011-03-29
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Publication No.: US08636335B2Publication Date: 2014-01-28
- Inventor: Akira Hotta , Shunsuke Watanabe
- Applicant: Akira Hotta , Shunsuke Watanabe
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2010-079649 20100330
- Main IPC: B41J2/175
- IPC: B41J2/175

Abstract:
A liquid ejecting head includes a main liquid ejecting head body, a head holder, and a sealing member, disposed between the main liquid ejecting head body and the head holder, that has a communication opening that communicates between a first liquid flow channel and a second liquid flow channel. The sealing member further has a close-contact portion provided at the circumferential edge of the communication opening; a first contact portion, provided in correspondence with the external circumferential portion of the main liquid ejecting head body, that protrudes toward the main liquid ejecting head body and makes contact with the main liquid ejecting head body; and a second contact portion that protrudes toward the head holder and makes contact with the head holder.
Public/Granted literature
- US20110242194A1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS Public/Granted day:2011-10-06
Information query
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