发明授权
US08638543B2 Laminated chip electronic component, board for mounting the same, and packing unit thereof
有权
层叠芯片电子部件,用于安装其的基板及其包装单元
- 专利标题: Laminated chip electronic component, board for mounting the same, and packing unit thereof
- 专利标题(中): 层叠芯片电子部件,用于安装其的基板及其包装单元
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申请号: US13588876申请日: 2012-08-17
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公开(公告)号: US08638543B2公开(公告)日: 2014-01-28
- 发明人: Young Ghyu Ahn , Min Cheol Park , Doo Young Kim , Sang Soo Park
- 申请人: Young Ghyu Ahn , Min Cheol Park , Doo Young Kim , Sang Soo Park
- 申请人地址: KR Suwon
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2012-0057724 20120530; KR10-2012-0089521 20120816
- 主分类号: H01G4/06
- IPC分类号: H01G4/06 ; H01G4/005
摘要:
A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; first and second external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer; and additional electrode layers disposed irrespective of a formation of capacitance within the lower cover layer.