发明授权
- 专利标题： Tape residue-free bump area after wafer back grinding
- 专利标题（中）： 晶圆后磨后胶带无残留区域
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申请号： US12726317申请日： 2010-03-17
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公开(公告)号： US08642390B2公开(公告)日： 2014-02-04
- 发明人: Chung Yu Wang , Jiann-Jong Wang
- 申请人： Chung Yu Wang , Jiann-Jong Wang
- 申请人地址： TW
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW
- 代理机构： Lowe Hauptman & Ham, LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/46
摘要：
Organic-adhesive tapes are often used to secure and protect the bumps during wafer processing after bump formation. While residual organic-adhesive tape may remain on the wafer after tape de-lamination, applying a bump template layer on the bumps before laminating the tape allows any residue to be removed afterwards and results in a residue-free wafer.
公开/授权文献
- US20110230043A1 TAPE RESIDUE-FREE BUMP AREA AFTER WAFER BACK GRINDING 公开/授权日：2011-09-22
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