利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

49 条记录 (耗时 0.022 秒)

    LED Flip-Chip Package Structure with Dummy Bumps
    4.
    发明申请
    LED Flip-Chip Package Structure with Dummy Bumps 有权
    LED倒装芯片封装结构，带有虚拟冲击

    公开(公告)号：US20120225509A1

    公开(公告)日：2012-09-06

    申请号：US13474282

    申请日：2012-05-17

    申请人： Chung Yu Wang

    发明人： Chung Yu Wang

    IPC分类号： H01L33/58 ,  H01L33/08

    CPC分类号： H01L33/62 ,  H01L24/17 ,  H01L33/486 ,  H01L33/54 ,  H01L33/642 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light-emitting device (LED) package component includes an LED chip having a first active bond pad and a second active bond pad. A carrier chip is bonded onto the LED chip through flip-chip bonding. The carrier chip includes a first active through-substrate via (TSV) and a second active TSV connected to the first and the second active bond pads, respectively. The carrier chip further includes a dummy TSV therein, which is electrically coupled to the first active bond pad, and is configured not to conduct any current when a current flows through the LED chip.

    摘要翻译： 发光器件（LED）封装部件包括具有第一有源接合焊盘和第二有源接合焊盘的LED芯片。 载体芯片通过倒装芯片接合结合到LED芯片上。 载体芯片包括分别连接到第一和第二有源接合焊盘的第一有源通过衬底通孔（TSV）和第二有源TSV。 载体芯片还包括其中的虚拟TSV，其电耦合到第一有源接合焊盘，并且被配置为在电流流过LED芯片时不导通任何电流。

    LED flip-chip package structure with dummy bumps
    5.
    发明授权
    LED flip-chip package structure with dummy bumps 有权
    LED倒装芯片封装结构，带虚拟凸块

    公开(公告)号：US08183579B2

    公开(公告)日：2012-05-22

    申请号：US12715838

    申请日：2010-03-02

    申请人： Chung Yu Wang

    发明人： Chung Yu Wang

    IPC分类号： H01L27/15 ,  H01L31/12 ,  H01L33/00

    CPC分类号： H01L33/62 ,  H01L24/17 ,  H01L33/486 ,  H01L33/54 ,  H01L33/642 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light-emitting device (LED) package component includes an LED chip having a first active bond pad and a second active bond pad. A carrier chip is bonded onto the LED chip through flip-chip bonding. The carrier chip includes a first active through-substrate via (TSV) and a second active TSV connected to the first and the second active bond pads, respectively. The carrier chip further includes a dummy TSV therein, which is electrically coupled to the first active bond pad, and is configured not to conduct any current when a current flows through the LED chip.

    摘要翻译： 发光器件（LED）封装部件包括具有第一有源接合焊盘和第二有源接合焊盘的LED芯片。 载体芯片通过倒装芯片接合结合到LED芯片上。 载体芯片包括分别连接到第一和第二有源接合焊盘的第一有源通过衬底通孔（TSV）和第二有源TSV。 载体芯片还包括其中的虚拟TSV，其电耦合到第一有源接合焊盘，并且被配置为在电流流过LED芯片时不导通任何电流。

    Structure of lighting device
    6.
    发明申请
    Structure of lighting device 审中-公开
    照明装置结构

    公开(公告)号：US20110317409A1

    公开(公告)日：2011-12-29

    申请号：US12801729

    申请日：2010-06-23

    申请人： Chih-Hsien Wu ,  Chung-Yu Wang ,  Meng-Chieh Chou

    发明人： Chih-Hsien Wu ,  Chung-Yu Wang ,  Meng-Chieh Chou

    IPC分类号： F21V29/00

    CPC分类号： F21K9/27 ,  F21Y2103/10 ,  F21Y2115/10

    摘要： A structure of lighting device includes a heat dissipater having opposite edges respectively forming a guide slot and a groove. A substrate board has an edge received and retained in the guide slot and an opposite edge forming a mounting hole. A fastener is received through the mounting hole to tightly engage the groove so as to fix the substrate board to the heat dissipater. No pre-machining of thread tapping is needed to form inner-threaded holes first. The structure of lighting device offers advantages in respect of simple structural arrangement, efficient manufacturing and production, reduced labor and material used, and lowering of costs.

    摘要翻译： 照明装置的结构包括具有分别形成引导槽和凹槽的相对边缘的散热器。 基板具有接收并保持在引导槽中的边缘和形成安装孔的相对边缘。 紧固件通过安装孔被接收以紧密地接合槽，以将基板固定到散热器上。 首先需要进行螺纹孔的预加工，以形成内螺纹孔。 照明装置的结构在简单的结构布置，高效的制造和生产，减少劳动力和使用的材料以及降低成本方面提供了优点。

    Thermally-Enhanced Hybrid LED Package Components
    8.
    发明申请
    Thermally-Enhanced Hybrid LED Package Components 有权
    热增强型混合LED封装组件

    公开(公告)号：US20110215361A1

    公开(公告)日：2011-09-08

    申请号：US12715872

    申请日：2010-03-02

    申请人： Chung Yu Wang

    发明人： Chung Yu Wang

    IPC分类号： H01L33/62

    CPC分类号： H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2924/00014

    摘要： A light-emitting device (LED) package component includes an LED chip and a carrier chip. The carrier chip includes a first bond pad and a second bond pad on a surface of the carrier chip and bonded onto the LED chip through flip-chip bonding, and a third bond pad and a fourth bond pad on the surface of the carrier chip and electrically connected to the first bond pad and the second bond pad, respectively. The first bond pad and the second bond pad are on a same side of the carrier chip facing the LED chip. The carrier chip further includes at least one through substrate via (TSV) connected to the first and second bond pads.

    摘要翻译： 发光器件（LED）封装部件包括LED芯片和载体芯片。 载体芯片包括在载体芯片的表面上的第一接合焊盘和第二接合焊盘，并通过倒装芯片接合结合到LED芯片上，以及在载体芯片的表面上的第三接合焊盘和第四接合焊盘， 电连接到第一接合焊盘和第二接合焊盘。 第一接合焊盘和第二接合焊盘位于与芯片相对的载体芯片的同一侧。 载体芯片还包括连接到第一和第二接合焊盘的至少一个贯穿衬底通孔（TSV）。

    Double Flip-Chip LED Package Components
    9.
    发明申请
    Double Flip-Chip LED Package Components 有权
    双倒装LED封装组件

    公开(公告)号：US20110215354A1

    公开(公告)日：2011-09-08

    申请号：US12715795

    申请日：2010-03-02

    申请人： Chung Yu Wang

    发明人： Chung Yu Wang

    IPC分类号： H01L33/58

    CPC分类号： H01L33/58 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light-emitting device (LED) package component includes an LED chip and a carrier chip. The carrier chip includes a first and a second bond pad on a surface of the carrier chip; and a third and a fourth bond pad on the surface of the carrier chip and electrically connected to the first and the second bond pads, respectively. The first, the second, the third, and the fourth bond pads are on a same surface of the carrier chip. The LED package component further includes a first and a second metal bump bonding the first and the second bond pads, respectively, onto the LED chip through flip-chip bonding; and a window-type module substrate bonded onto the third and the fourth bond pads through flip-chip bonding. The window-type module substrate includes a window, with the LED chip configured to emit light toward the window.

    摘要翻译： 发光器件（LED）封装部件包括LED芯片和载体芯片。 载体芯片包括在载体芯片的表面上的第一和第二接合焊盘; 以及在载体芯片的表面上分别电连接到第一和第二接合焊盘的第三和第四接合焊盘。 第一，第二，第三和第四接合焊盘位于载体芯片的相同表面上。 LED封装部件还包括通过倒装芯片焊接将第一和第二接合焊盘分别结合到LED芯片上的第一和第二金属凸块; 以及通过倒装芯片接合键合到第三和第四接合焊盘上的窗型模块衬底。 窗型模块基板包括窗口，其中LED芯片配置成向窗口发射光。