发明授权
- 专利标题： Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus
- 专利标题（中）： 用于制造和与电子设备进行平面接触的方法，以及相应制造的装置
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申请号： US12224608申请日： 2006-12-21
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公开(公告)号： US08642465B2公开(公告)日： 2014-02-04
- 发明人: Gernot Schimetta , Maximilian Tschemitz
- 申请人： Gernot Schimetta , Maximilian Tschemitz
- 申请人地址： DE Munich
- 专利权人： Siemens Aktiengesellschaft
- 当前专利权人： Siemens Aktiengesellschaft
- 当前专利权人地址： DE Munich
- 代理机构： Staas & Halsey LLP
- 优先权： DE102006009723 20060302
- 国际申请： PCT/EP2006/070110 WO 20061221
- 国际公布： WO2007/098820 WO 20070907
- 主分类号： H01L21/4763
- IPC分类号： H01L21/4763
摘要：
Reliable electrical contact is made with electronic components and effective electrical isolation is produced between the top and bottom of the electronic components. An electronic component is arranged inside a window in a first layer on a substrate. Next, a second layer is put on such that contact areas on the component and contact points on the first layer are freely accessible. Electrical contacts and electrical connecting lines are produced by electrodeposition. The second layer is used to produce bridges over an interval range between the electronic component and the first layer. The bridges have connecting lines formed on them. The second layer can be removed again. Radio-frequency modules can be produced in compact fashion and can be combined with audio-frequency components.
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