公开(公告)号：US08642465B2

公开(公告)日：2014-02-04

申请号：US12224608

申请日：2006-12-21

申请人： Gernot Schimetta ,  Maximilian Tschemitz

发明人： Gernot Schimetta ,  Maximilian Tschemitz

IPC分类号： H01L21/4763

CPC分类号： H01L23/66 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/18 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/82

摘要： Reliable electrical contact is made with electronic components and effective electrical isolation is produced between the top and bottom of the electronic components. An electronic component is arranged inside a window in a first layer on a substrate. Next, a second layer is put on such that contact areas on the component and contact points on the first layer are freely accessible. Electrical contacts and electrical connecting lines are produced by electrodeposition. The second layer is used to produce bridges over an interval range between the electronic component and the first layer. The bridges have connecting lines formed on them. The second layer can be removed again. Radio-frequency modules can be produced in compact fashion and can be combined with audio-frequency components.

摘要翻译： 用电子部件进行可靠的电气接触，并在电子部件的顶部和底部之间产生有效的电气隔离。 电子部件布置在基板上的第一层中的窗口内。 接下来，放置第二层，使得组件上的接触区域和第一层上的接触点可自由接近。 电触点和电连接线通过电沉积生产。 第二层用于在电子部件和第一层之间的间隔范围内产生桥梁。 桥梁上形成有连接线。 可以再次删除第二层。 射频模块可以紧凑地制造，并且可以与音频组件组合。