发明授权
- 专利标题: Power semiconductor device and method of manufacturing the same
- 专利标题(中): 功率半导体器件及其制造方法
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申请号: US13229203申请日: 2011-09-09
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公开(公告)号: US08643056B2公开(公告)日: 2014-02-04
- 发明人: Kiyoshi Kimura , Yasuto Sumi , Hiroshi Ohta , Hiroyuki Irifune
- 申请人: Kiyoshi Kimura , Yasuto Sumi , Hiroshi Ohta , Hiroyuki Irifune
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Patterson & Sheridan, LLP
- 优先权: JP2010-203423 20100910
- 主分类号: H01L29/66
- IPC分类号: H01L29/66
摘要:
A power semiconductor device includes a first semiconductor layer of a first conductivity type, a first drift layer, and a second drift layer. The first drift layer includes a first epitaxial layer of the first conductivity type, a plurality of first first-conductivity-type pillar layers, and a plurality of first second-conductivity-type pillar layers. The second drift layer is formed on the first drift layer and includes a second epitaxial layer of the first conductivity type, a plurality of second second-conductivity-type pillar layers, a plurality of second first-conductivity-type pillar layers, a plurality of third second-conductivity-type pillar layers, and a plurality of third first-conductivity-type pillar layers. The plurality of second second-conductivity-type pillar layers are connected to the first second-conductivity-type pillar layers. The plurality of second first-conductivity-type pillar layers are connected to the first first-conductivity-type pillar layers. The plurality of third second-conductivity-type pillar layers are arranged on the first epitaxial layer.
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