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发明授权
US08643163B2 Integrated circuit package-on-package stacking system and method of manufacture thereof 有权
集成电路封装堆叠堆叠系统及其制造方法

Integrated circuit package-on-package stacking system and method of manufacture thereof
摘要：
An integrated circuit package-on-package stacking system includes: providing a first integrated circuit package, mounting a metalized interposer substrate over the first integrated circuit package, attaching a stiffener integrated with the metalized interposer substrate and having dimensions within package extents, and attaching a second integrated circuit package on the metalized interposer substrate adjacent the stiffener.
摘要（中）：

集成电路封装堆叠堆叠系统包括：提供第一集成电路封装，将金属化插入器基板安装在第一集成电路封装上，附接与金属化插入器基板集成的加强件并具有尺寸在封装范围内， 第二集成电路封装在与加强件相邻的金属化插入器基板上。

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