Gluing process for micro-structured substrates. The invention is applicable particularly to the fabrication of micro-fluidic components. In order to glue a micro-structured substrate having upper coplanar plane areas and recesses between them, a grid is placed above the substrate, the grid is coated with a glue, using a tool that presses on the grid and locally brings it into contact with the areas, so as to deposit a film of glue droplets on them, and the grid is removed. Furthermore, the upper coplanar plane areas are treated before the film of glue droplets is deposited, this treatment being designed to adapt wettability of these areas to the glue.