Invention Grant
- Patent Title: Residual layer thickness measurement and correction
- Patent Title (中): 残余层厚度测量和校正
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Application No.: US12835009Application Date: 2010-07-13
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Publication No.: US08647554B2Publication Date: 2014-02-11
- Inventor: Christopher Ellis Jones , Niyaz Khusnatdinov , Stephen C. Johnson , Philip D. Schumaker , Pankaj B. Lad
- Applicant: Christopher Ellis Jones , Niyaz Khusnatdinov , Stephen C. Johnson , Philip D. Schumaker , Pankaj B. Lad
- Applicant Address: US TX Austin
- Assignee: Molecular Imprints, Inc.
- Current Assignee: Molecular Imprints, Inc.
- Current Assignee Address: US TX Austin
- Agent Cameron A. King
- Main IPC: B27N3/18
- IPC: B27N3/18
Abstract:
In nano-imprint lithography it is important to detect thickness non-uniformity of a residual layer formed on a substrate. Such non-uniformity is compensated such that a uniform residual layer may be formed. Compensation is performed by calculating a corrected fluid drop pattern.
Public/Granted literature
- US20100286811A1 Residual Layer Thickness Measurement and Correction Public/Granted day:2010-11-11
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