Invention Grant
US08652932B2 Semiconductor devices having fin structures, and methods of forming semiconductor devices having fin structures
有权
具有翅片结构的半导体器件,以及形成具有翅片结构的半导体器件的方法
- Patent Title: Semiconductor devices having fin structures, and methods of forming semiconductor devices having fin structures
- Patent Title (中): 具有翅片结构的半导体器件,以及形成具有翅片结构的半导体器件的方法
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Application No.: US13448749Application Date: 2012-04-17
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Publication No.: US08652932B2Publication Date: 2014-02-18
- Inventor: Thomas N. Adam , Kangguo Cheng , Ali Khakifirooz , Alexander Reznicek
- Applicant: Thomas N. Adam , Kangguo Cheng , Ali Khakifirooz , Alexander Reznicek
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Parashos Kalaitzis, Esq.
- Main IPC: H01L21/76
- IPC: H01L21/76

Abstract:
A semiconductor device including at least two fin structures on a substrate surface and a functional gate structure present on the at least two fin structures. The functional gate structure includes at least one gate dielectric that is in direct contact with at least the sidewalls of the two fin structures, and at least one gate conductor on the at least one gate dielectric. The sidewall of the gate structure is substantially perpendicular to the upper surface of the substrate surface, wherein the plane defined by the sidewall of the gate structure and a plane defined by an upper surface of the substrate surface intersect at an angle of 90°+/−5°. An epitaxial semiconductor material is in direct contact with the at least two fin structures.
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