Invention Grant
US08652938B2 Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device
有权
用于半导体背面的可热分解的片状集成膜，半导体元件的集成方法以及半导体器件的制造方法
- Patent Title: Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device
- Patent Title (中): 用于半导体背面的可热分解的片状集成膜，半导体元件的集成方法以及半导体器件的制造方法
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Application No.: US13190664Application Date: 2011-07-26
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Publication No.: US08652938B2Publication Date: 2014-02-18
- Inventor: Naohide Takamoto , Goji Shiga , Fumiteru Asai
- Applicant: Naohide Takamoto , Goji Shiga , Fumiteru Asai
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-170919 20100729
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
The present invention relates to a thermally releasable sheet-integrated film for semiconductor back surface, which includes: a pressure-sensitive adhesive sheet including a base material layer and a pressure-sensitive adhesive layer, and a film for semiconductor back surface formed on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet, in which the pressure-sensitive adhesive sheet is a thermally releasable pressure-sensitive adhesive sheet whose peel force from the film for semiconductor back surface decreases upon heating.
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