发明授权
- 专利标题: Zigzag pattern for TSV copper adhesion
- 专利标题(中): Zigzag图案为TSV铜附着力
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申请号: US12245505申请日: 2008-10-03
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公开(公告)号: US08653648B2公开(公告)日: 2014-02-18
- 发明人: Chih-Hua Chen , Chen-Shien Chen , Chen-Cheng Kuo , Wen-Wei Shen
- 申请人: Chih-Hua Chen , Chen-Shien Chen , Chen-Cheng Kuo , Wen-Wei Shen
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Slater & Matsil, L.L.P.
- 主分类号: H01L23/04
- IPC分类号: H01L23/04
摘要:
A system and method for forming a TSV contact is presented. A preferred embodiment includes a TSV in contact with a portion of the uppermost metal layer of a semiconductor die. The interface between the TSV conductor and the contact pad is preferably characterized by a non-planar zigzag pattern that forms a grid pattern of contacts. Alternatively, the contacts may form a plurality of metal lines that make contact with the contact pad.
公开/授权文献
- US20100084747A1 Zigzag Pattern for TSV Copper Adhesion 公开/授权日:2010-04-08