Invention Grant
- Patent Title: High bandwidth memory interface
- Patent Title (中): 高带宽存储器接口
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Application No.: US13743794Application Date: 2013-01-17
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Publication No.: US08654573B2Publication Date: 2014-02-18
- Inventor: Peter B. Gillingham , Bruce Millar
- Applicant: Mosaid Technologies Incorporated
- Applicant Address: CA Ottawa, Ontario
- Assignee: MOSAID Technologies Incorporated
- Current Assignee: MOSAID Technologies Incorporated
- Current Assignee Address: CA Ottawa, Ontario
- Agency: Borden Ladner Gervais LLP
- Agent Shin Hung
- Priority: CA2243892 19980727
- Main IPC: G11C11/00
- IPC: G11C11/00

Abstract:
A memory module that includes a buffer and a plurality of synchronous memory devices. The memory module also includes bidirectional bus lines, and each of the synchronous memory devices has bidirectional data terminals. The buffer is configured to regenerate signals received on the bus lines for receipt by the synchronous memory devices, and to regenerate signals received from any one of the synchronous memory devices for receipt by the bus lines. The memory module may further include command lines and a clock line for providing commands and a clock signal to the synchronous memory devices via a command buffer. The combined data bus width of the memory module may be greater than the data bus width of any single one of synchronous memory device, and the total address space provided by the memory module may be larger than the data space for any single synchronous memory device.
Public/Granted literature
- US20130132761A1 MEMORY MODULE INCLUDING A PLURALITY OF SYNCHRONOUS MEMORY DEVICES Public/Granted day:2013-05-23
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