The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.