Invention Grant
- Patent Title: Flex-rigid wiring board and method for manufacturing the same
- Patent Title (中): 挠性刚性接线板及其制造方法
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Application No.: US12914064Application Date: 2010-10-28
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Publication No.: US08658904B2Publication Date: 2014-02-25
- Inventor: Nobuyuki Naganuma , Michimasa Takahashi , Masakazu Aoyama
- Applicant: Nobuyuki Naganuma , Michimasa Takahashi , Masakazu Aoyama
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H05K1/03
- IPC: H05K1/03

Abstract:
A flex-rigid wiring board including a flexible wiring board, a first insulation layer positioned to a side of the flexible board and having a first hole through the first layer, a second insulation layer over the first layer and an end portion of the flexible board and with a second hole through the second layer along the axis of the first hole, a third insulation layer over the first layer and the end portion of the flexible board on the opposite side of the second layer and with a third hole through the third layer along the axis of the first hole, a first structure having a filled conductor in the first hole, a second structure having a filled conductor in the second hole along the axis of the first structure, and a third structure having a filled conductor in the third hole along the axis of the first structure.
Public/Granted literature
- US20110180306A1 FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2011-07-28
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