Invention Grant
- Patent Title: Inputting module and submount thereof and manufacturing method of the submount
- Patent Title (中): 输入模块及其基座及其安装的制造方法
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Application No.: US13198902Application Date: 2011-08-05
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Publication No.: US08658961B2Publication Date: 2014-02-25
- Inventor: Chih-Cheng Chen , Jin-Shan Pan
- Applicant: Chih-Cheng Chen , Jin-Shan Pan
- Applicant Address: TW Hsinchu
- Assignee: True Light Corporation
- Current Assignee: True Light Corporation
- Current Assignee Address: TW Hsinchu
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Main IPC: H01J3/14
- IPC: H01J3/14

Abstract:
A submount is used for disposing an illuminant element or a light-receiving element having an optical axis. The submount is disposed at a plane and has a main body. The main body includes a first surface and a second surface. The first surface is approximately parallel to the plane and far away from the plane. The second surface is approximately parallel to the plane and adjacent to the plane. A disposing part of the first surface is tilted with respect to the second surface at a predetermined angle. The illuminant element or the light-receiving element is disposed on the disposing part. The optical axis of the illuminant element or the light-receiving element is tiled with respect to a normal of the second surface at the predetermined angle.
Public/Granted literature
- US20130032701A1 INPUTTING MODULE AND SUBMOUNT THEREOF AND MANUFACTURING METHOD OF THE SUBMOUNT Public/Granted day:2013-02-07
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