Invention Grant
- Patent Title: Light emitting device package and method for fabricating the same
- Patent Title (中): 发光器件封装及其制造方法
-
Application No.: US12837094Application Date: 2010-07-15
-
Publication No.: US08659046B2Publication Date: 2014-02-25
- Inventor: Tae Yun Kim
- Applicant: Tae Yun Kim
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: McKenna Long & Aldridge, LLP
- Priority: KR10-2009-0067782 20090724
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/48
Abstract:
Disclosed are a light emitting device package and a method for fabricating the same. The light emitting device package includes: a trench formed in a substrate; a light emitting structure which is directly grown on a first area of the trench in the substrate; an electrode on the substrate; a wire bonding connecting the electrode with the light emitting structure; anda filler filling the trench.
Public/Granted literature
- US20110018021A1 LIGHT EMITTING DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2011-01-27
Information query
IPC分类:
