发明授权
- 专利标题： Metal pad structures in dies
- 专利标题（中）： 模具中的金属垫结构
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申请号： US13247616申请日： 2011-09-28
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公开(公告)号： US08659123B2公开(公告)日： 2014-02-25
- 发明人: Yao-Chun Chuang , Chita Chuang , Chen-Cheng Kuo , Chen-Shien Chen
- 申请人： Yao-Chun Chuang , Chita Chuang , Chen-Cheng Kuo , Chen-Shien Chen
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/58
- IPC分类号： H01L23/58
摘要：
A die includes a substrate, a metal pad over the substrate, and a passivation layer that has a portion over the metal pad. A dummy pattern is disposed adjacent to the metal pad. The dummy pattern is level with, and is formed of a same material as, the metal pad. The dummy pattern forms at least a partial ring surrounding at least a third of the metal pad.
公开/授权文献
- US20130075872A1 Metal Pad Structures in Dies 公开/授权日：2013-03-28