Invention Grant
- Patent Title: Flip chip package structure with heat dissipation enhancement and its application
- Patent Title (中): 倒装芯片封装结构具有散热增强及其应用
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Application No.: US13043782Application Date: 2011-03-09
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Publication No.: US08659128B2Publication Date: 2014-02-25
- Inventor: Yu-Lin Yang , Lih-Ming Doong
- Applicant: Yu-Lin Yang , Lih-Ming Doong
- Applicant Address: TW Hsinchu
- Assignee: Richtek Technology Corp.
- Current Assignee: Richtek Technology Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW99107271A 20100312
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A flip chip package structure includes a chip placed under a lead frame, a bump on the upper surface of the chip that is electrically connected to the lead of the lead frame, and a backside metal on the lower surface of the chip that is exposed outside an encapsulant encapsulating the chip and a portion of the lead frame.
Public/Granted literature
- US20110221047A1 FLIP CHIP PACKAGE STRUCTURE WITH HEAT DISSIPATION ENHANCEMENT AND ITS APPLICATION Public/Granted day:2011-09-15
Information query
IPC分类:
