Invention Grant
- Patent Title: Wiring substrate in which equal-length wires are formed
- Patent Title (中): 形成等长导线的布线基板
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Application No.: US13156049Application Date: 2011-06-08
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Publication No.: US08659927B2Publication Date: 2014-02-25
- Inventor: Takashi Ichimura , Takanobu Naruse , Chiaki Fujii
- Applicant: Takashi Ichimura , Takanobu Naruse , Chiaki Fujii
- Applicant Address: JP Kyoto JP Kanagawa
- Assignee: Murata Manufacturing Co., Ltd,Renesas Electronics Corporation
- Current Assignee: Murata Manufacturing Co., Ltd,Renesas Electronics Corporation
- Current Assignee Address: JP Kyoto JP Kanagawa
- Agency: Studebaker & Brackett PC
- Priority: JP2010-132354 20100609
- Main IPC: G11C5/06
- IPC: G11C5/06

Abstract:
In a wiring substrate, a double data rate (DDR) memory and a memory controller controlling the DDR memory are mounted. Further, in the wiring substrate, plural equal-length wires connecting the DDR memory and the memory controller are formed. The plural equal-length wires include a differential transmission line, such as a clock wire transmitting a clock signal, which is connected via a common mode choke coil. The differential transmission line may have a wire length shorter than a wire length of another equal-length wire, by a wire length corresponding to delay time of a transmission signal due to the common mode choke coil.
Public/Granted literature
- US20110305060A1 WIRING SUBSTRATE IN WHICH EQUAL-LENGTH WIRES ARE FORMED Public/Granted day:2011-12-15
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