Invention Grant
- Patent Title: Semiconductor memory device
- Patent Title (中): 半导体存储器件
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Application No.: US13902863Application Date: 2013-05-27
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Publication No.: US08659950B1Publication Date: 2014-02-25
- Inventor: Masaru Yano , Lu-Ping Chiang
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: Jianq Chyun IP Office
- Priority: JP2012-189479 20120830
- Main IPC: G11C16/06
- IPC: G11C16/06

Abstract:
A semiconductor memory device performing high speed reading with a miniaturized sensing circuit is provided. A pre-charge voltage from a virtual potential VPRE′ is provided to an odd bit line when an even bit line is selected, the pre-charge voltage is provided from a source voltage supply unit 230 to a shared odd source line SL_o, a ground potential is provided from the source voltage supply unit 230 to an even source line SL_e.
Public/Granted literature
- US20140063970A1 SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2014-03-06
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