Invention Grant
- Patent Title: Substrate replacing method and substrate processing apparatus
- Patent Title (中): 基板更换方法和基板处理装置
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Application No.: US12732451Application Date: 2010-03-26
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Publication No.: US08663489B2Publication Date: 2014-03-04
- Inventor: Shigeru Ishizawa , Hiroshi Koizumi , Tatsuya Ogi
- Applicant: Shigeru Ishizawa , Hiroshi Koizumi , Tatsuya Ogi
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2009-089509 20090401
- Main IPC: B44C1/22
- IPC: B44C1/22

Abstract:
A method for replacing plural substrates to be processed by a substrate processing apparatus which includes a substrate processing chamber, a load lock chamber, and a conveying apparatus including first and second conveying members for conveying the plural substrates into and out from the substrate processing chamber and the load lock chamber. The method includes the steps of a) conveying a first substrate out from the substrate processing chamber with the first conveying member, b) conveying a second substrate into the substrate processing chamber with the second conveying member, c) conveying the second substrate out from the load lock chamber with the second conveying member, and d) conveying the first substrate into the load lock chamber with the first conveying member. The steps c) and d) are performed between step a) and step b).
Public/Granted literature
- US20100252532A1 SUBSTRATE REPLACING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2010-10-07
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