发明授权
- 专利标题： Integrated circuit packaging system with stacked paddle and method of manufacture thereof
- 专利标题（中）： 具有堆叠桨的集成电路封装系统及其制造方法
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申请号： US12328759申请日： 2008-12-04
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公开(公告)号： US08664038B2公开(公告)日： 2014-03-04
- 发明人: Zigmund Ramirez Camacho , Arnel Senosa Trasporto , Lionel Chien Hui Tay , Jose Alvin Caparas
- 申请人： Zigmund Ramirez Camacho , Arnel Senosa Trasporto , Lionel Chien Hui Tay , Jose Alvin Caparas
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method of manufacture of an integrated circuit packaging system includes: forming a package paddle and a terminal adjacent to the package paddle; mounting a stack paddle over the package paddle with the stack paddle at a non-center offset with the package paddle; mounting a stack integrated circuit over the stack paddle; and encapsulating the stack integrated circuit and the stack paddle.
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