Invention Grant
US08664748B2 Package-level integrated circuit connection without top metal pads or bonding wire
失效
封装级集成电路连接，无顶部金属焊盘或接合线
- Patent Title: Package-level integrated circuit connection without top metal pads or bonding wire
- Patent Title (中): 封装级集成电路连接，无顶部金属焊盘或接合线
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Application No.: US12701122Application Date: 2010-02-05
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Publication No.: US08664748B2Publication Date: 2014-03-04
- Inventor: Hong Beom Pyeon
- Applicant: Hong Beom Pyeon
- Applicant Address: CA Ottawa, Ontario
- Assignee: Mosaid Technologies Incorporated
- Current Assignee: Mosaid Technologies Incorporated
- Current Assignee Address: CA Ottawa, Ontario
- Agent Harvey Auerback
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L21/78
Abstract:
An integrated circuit apparatus is provided with package-level connectivity, between internal electronic circuitry thereof and contact points on a package substrate thereof, without requiring top metal pads or bonding wires.
Public/Granted literature
- US20110037148A1 PACKAGE-LEVEL INTEGRATED CIRCUIT CONNECTION WITHOUT TOP METAL PADS OR BONDING WIRE Public/Granted day:2011-02-17
Information query
IPC分类:
