Invention Grant
US08664778B2 Method of flip-chip hybridization for the forming of tight cavities and systems obtained by such a method
有权
用于形成紧密腔的倒装芯片杂交方法和通过这种方法获得的系统的方法
- Patent Title: Method of flip-chip hybridization for the forming of tight cavities and systems obtained by such a method
- Patent Title (中): 用于形成紧密腔的倒装芯片杂交方法和通过这种方法获得的系统的方法
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Application No.: US13531842Application Date: 2012-06-25
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Publication No.: US08664778B2Publication Date: 2014-03-04
- Inventor: Francois Marion
- Applicant: Francois Marion
- Applicant Address: FR Paris
- Assignee: Commissariat a l'Energie Atomique et aux Energies Alternatives
- Current Assignee: Commissariat a l'Energie Atomique et aux Energies Alternatives
- Current Assignee Address: FR Paris
- Agency: Burr & Brown, PLLC
- Priority: FR1155913 20110630
- Main IPC: H01L23/28
- IPC: H01L23/28
Abstract:
A method for manufacturing a microelectronic assembly including stacked first and second microelectronic components having a cavity therebetween including defining said cavity by means of a lateral wall forming a closed frame extending around a determined area of the first component except for an opening used as a vent; forming within the closed frame and opposite to the vent an obstacle capable of forming, in cooperation with the lateral wall, a bypass duct for the filling material; performing a flip-chip hybridization of the first and second components, a surface of the second component resting on the upper edge or end of the lateral wall formed on the first component to form said at least one cavity; injecting the filling material in liquid form between the two hybridized components to embed said at least one cavity and to make it tight by obstruction of the vent as said filling material solidifies.
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