Invention Grant
- Patent Title: Power mesh management method
- Patent Title (中): 电力网管理方法
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Application No.: US12359950Application Date: 2009-01-26
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Publication No.: US08667445B2Publication Date: 2014-03-04
- Inventor: Chia-Lin Chuang
- Applicant: Chia-Lin Chuang
- Applicant Address: TW Hsinchu
- Assignee: Realtek Semiconductor Corp.
- Current Assignee: Realtek Semiconductor Corp.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW97103382A 20080130
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
The invention discloses a power mesh management method utilized in an integrated IC. The integrated circuit includes a macro block including at least a macro block power supplying line growing along a first direction. The management method includes: defining a plurality of first power supplying lines located in a metal layer above the macro block, wherein each of the first supplying lines grows along the first direction; defining a plurality of second power supplying lines located in another metal layer above the macro block, wherein each of the second supplying lines grows along a second direction; defining a partial power supplying line from the plurality of first power supplying lines where the partial power supplying line overlaps the macro block power supplying line; and removing the partial power supplying line from the plurality of first power supplying lines.
Public/Granted literature
- US20090193381A1 POWER MESH MANAGEMENT METHOD Public/Granted day:2009-07-30
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