摘要:
The invention discloses a power mesh arrangement method utilized in an integrated circuit having multiple power domains. The arrangement method includes: forming a first partial local power mesh according to a position of a first power domain; forming a second partial local power mesh according to a position of a second power domain; forming a global power mesh, utilized for providing powers needed by the first and the second power domains; coupling the first partial local power mesh to the global power mesh and the first power domain; and coupling the second partial local power mesh to the global power mesh and the second power domain.
摘要:
The invention discloses a power mesh management method utilized in an integrated IC. The integrated circuit includes a macro block including at least a macro block power supplying line growing along a first direction. The management method includes: defining a plurality of first power supplying lines located in a metal layer above the macro block, wherein each of the first supplying lines grows along the first direction; defining a plurality of second power supplying lines located in another metal layer above the macro block, wherein each of the second supplying lines grows along a second direction; defining a partial power supplying line from the plurality of first power supplying lines where the partial power supplying line overlaps the macro block power supplying line; and removing the partial power supplying line from the plurality of first power supplying lines.
摘要:
The invention discloses a power mesh managing method utilized in an integrated circuit. The integrated circuit includes a standard cell and a standard-cell power supplying mesh corresponding to a first direction. The power mesh managing method includes: defining a power supplying network including a first plurality of power meshes growing along the first direction and a second plurality of power meshes growing along a second direction, and defining an assistant connecting network on a third metal layer, wherein the assistant connecting network includes a plurality of assistant connecting lines growing along the second direction, the first plurality of power meshes are formed on a first metal layer, the second plurality of power meshes on a second metal layer, the third metal layer is below the first metal layer, and the second metal layer is above the first metal layer.
摘要:
A method for designing a power distribution network of a circuit system includes the following steps: determining positions of a plurality of power source nodes; estimating a current distribution condition of the circuit system; and creating a first part of the power distribution network according to at least the positions of the power source nodes.
摘要:
A method for designing a power distribution network of a circuit system includes the following steps: determining positions of a plurality of power source nodes; estimating a current distribution condition of the circuit system; and creating a first part of the power distribution network according to at least the positions of the power source nodes
摘要:
The invention discloses a power mesh arrangement method utilized in an integrated circuit having multiple power domains. The arrangement method includes: forming a first partial local power mesh according to a position of a first power domain; forming a second partial local power mesh according to a position of a second power domain; forming a global power mesh, utilized for providing powers needed by the first and the second power domains; coupling the first partial local power mesh to the global power mesh and the first power domain; and coupling the second partial local power mesh to the global power mesh and the second power domain.
摘要:
An integrated circuit chip includes a power/ground interconnection network in a topmost metal layer over a semiconductor substrate and at least a bump pad on/over the power/ground interconnection network. The power/ground mesh interconnection network includes a first power/ground line connected to the bump pad and extending along a first direction, and a connection portion connected to the bump pad and extending along a second direction.
摘要:
The invention discloses a power mesh managing method utilized in an integrated circuit. The integrated circuit includes a standard cell and a standard-cell power supplying mesh corresponding to a first direction. The power mesh managing method includes: defining a power supplying network including a first plurality of power meshes growing along the first direction and a second plurality of power meshes growing along a second direction, and defining an assistant connecting network on a third metal layer, wherein the assistant connecting network includes a plurality of assistant connecting lines growing along the second direction, the first plurality of power meshes are formed on a first metal layer, the second plurality of power meshes on a second metal layer, the third metal layer is below the first metal layer, and the second metal layer is above the first metal layer.
摘要:
The invention discloses a technique for designing the power layout of an integrated circuit. The power layout design forms a power mesh and a power ring with a plurality of metal trunks with uniform line width. In particular, the power ring includes a plurality of metal rings, which are formed by arranging denser layout of the metal trunks with uniform line width. The power ring serves as a function of receiving and providing a power source to the elements of the integrated circuit.
摘要:
The invention discloses a technique for designing the power layout of an integrated circuit. The power layout design forms a power mesh and a power ring with a plurality of metal trunks with uniform line width. In particular, the power ring includes a plurality of metal rings, which are formed by arranging denser layout of the metal trunks with uniform line width. The power ring serves as a function of receiving and providing a power source to the elements of the integrated circuit.