Power mesh arrangement method utilized in an integrated circuit having multiple power domains
    1.
    发明授权
    Power mesh arrangement method utilized in an integrated circuit having multiple power domains 有权
    在具有多个功率域的集成电路中使用的功率网布置方法

    公开(公告)号:US08006218B2

    公开(公告)日:2011-08-23

    申请号:US12271534

    申请日:2008-11-14

    申请人: Chia-Lin Chuang

    发明人: Chia-Lin Chuang

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5077 G06F2217/78

    摘要: The invention discloses a power mesh arrangement method utilized in an integrated circuit having multiple power domains. The arrangement method includes: forming a first partial local power mesh according to a position of a first power domain; forming a second partial local power mesh according to a position of a second power domain; forming a global power mesh, utilized for providing powers needed by the first and the second power domains; coupling the first partial local power mesh to the global power mesh and the first power domain; and coupling the second partial local power mesh to the global power mesh and the second power domain.

    摘要翻译: 本发明公开了一种在具有多个功率域的集成电路中使用的功率网布置方法。 该布置方法包括:根据第一功率域的位置形成第一部分局部功率网格; 根据第二功率域的位置形成第二部分局部功率网格; 形成用于提供第一和第二电力域所需功率的全局电力网; 将第一部分局部功率网格耦合到全局功率网格和第一功率域; 以及将所述第二部分局部功率网格耦合到所述全局功率网格和所述第二功率域。

    Power mesh management method
    2.
    发明授权
    Power mesh management method 有权
    电力网管理方法

    公开(公告)号:US08667445B2

    公开(公告)日:2014-03-04

    申请号:US12359950

    申请日:2009-01-26

    申请人: Chia-Lin Chuang

    发明人: Chia-Lin Chuang

    IPC分类号: G06F17/50

    摘要: The invention discloses a power mesh management method utilized in an integrated IC. The integrated circuit includes a macro block including at least a macro block power supplying line growing along a first direction. The management method includes: defining a plurality of first power supplying lines located in a metal layer above the macro block, wherein each of the first supplying lines grows along the first direction; defining a plurality of second power supplying lines located in another metal layer above the macro block, wherein each of the second supplying lines grows along a second direction; defining a partial power supplying line from the plurality of first power supplying lines where the partial power supplying line overlaps the macro block power supplying line; and removing the partial power supplying line from the plurality of first power supplying lines.

    摘要翻译: 本发明公开了一种集成IC中使用的功率管理方法。 集成电路包括至少包括沿着第一方向生长的宏块供电线的宏块。 管理方法包括:定义位于宏块上方的金属层中的多个第一供电线,其中每条第一供电线沿第一方向生长; 限定位于所述宏块上方的另一金属层中的多个第二供电线,其中所述第二供应线中的每一个沿第二方向生长; 从所述多个第一供电线定义部分供电线,其中所述部分供电线与所述宏块供电线重叠; 以及从所述多个第一供电线去除所述部分供电线。

    Power mesh managing method
    3.
    发明授权
    Power mesh managing method 有权
    电力网管理方法

    公开(公告)号:US08413100B2

    公开(公告)日:2013-04-02

    申请号:US13568228

    申请日:2012-08-07

    申请人: Chia-Lin Chuang

    发明人: Chia-Lin Chuang

    IPC分类号: G06F17/50

    摘要: The invention discloses a power mesh managing method utilized in an integrated circuit. The integrated circuit includes a standard cell and a standard-cell power supplying mesh corresponding to a first direction. The power mesh managing method includes: defining a power supplying network including a first plurality of power meshes growing along the first direction and a second plurality of power meshes growing along a second direction, and defining an assistant connecting network on a third metal layer, wherein the assistant connecting network includes a plurality of assistant connecting lines growing along the second direction, the first plurality of power meshes are formed on a first metal layer, the second plurality of power meshes on a second metal layer, the third metal layer is below the first metal layer, and the second metal layer is above the first metal layer.

    摘要翻译: 本发明公开了一种集成电路中使用的电力网管理方法。 集成电路包括对应于第一方向的标准单元和标准单元供电网。 功率网管理方法包括:定义供电网络,其包括沿着第一方向生长的第一多个电力网格和沿着第二方向生长的第二多个电力网格,以及在第三金属层上限定辅助连接网络,其中 辅助连接网络包括沿着第二方向生长的多个辅助连接线,第一多个电网形成在第一金属层上,第二多个电源在第二金属层上,第三金属层在 第一金属层,第二金属层在第一金属层的上方。

    POWER MESH ARRANGEMENT METHOD UTILIZED IN AN INTEGRATED CIRCUIT HAVING MULTIPLE POWER DOMAINS
    6.
    发明申请
    POWER MESH ARRANGEMENT METHOD UTILIZED IN AN INTEGRATED CIRCUIT HAVING MULTIPLE POWER DOMAINS 有权
    在具有多个电源域的集成电路中使用的功率网格布置方法

    公开(公告)号:US20090132988A1

    公开(公告)日:2009-05-21

    申请号:US12271534

    申请日:2008-11-14

    申请人: Chia-Lin Chuang

    发明人: Chia-Lin Chuang

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5077 G06F2217/78

    摘要: The invention discloses a power mesh arrangement method utilized in an integrated circuit having multiple power domains. The arrangement method includes: forming a first partial local power mesh according to a position of a first power domain; forming a second partial local power mesh according to a position of a second power domain; forming a global power mesh, utilized for providing powers needed by the first and the second power domains; coupling the first partial local power mesh to the global power mesh and the first power domain; and coupling the second partial local power mesh to the global power mesh and the second power domain.

    摘要翻译: 本发明公开了一种在具有多个功率域的集成电路中使用的功率网布置方法。 该布置方法包括:根据第一功率域的位置形成第一部分局部功率网格; 根据第二功率域的位置形成第二部分局部功率网格; 形成用于提供第一和第二电力域所需功率的全局电力网; 将第一部分局部功率网格耦合到全局功率网格和第一功率域; 以及将所述第二部分局部功率网格耦合到所述全局功率网格和所述第二功率域。

    INTEGRATED CIRCUIT CHIP WITH REDUCED IR DROP
    7.
    发明申请
    INTEGRATED CIRCUIT CHIP WITH REDUCED IR DROP 有权
    集成电路芯片,减少红外线

    公开(公告)号:US20130037934A1

    公开(公告)日:2013-02-14

    申请号:US13205648

    申请日:2011-08-09

    IPC分类号: H01L23/48

    摘要: An integrated circuit chip includes a power/ground interconnection network in a topmost metal layer over a semiconductor substrate and at least a bump pad on/over the power/ground interconnection network. The power/ground mesh interconnection network includes a first power/ground line connected to the bump pad and extending along a first direction, and a connection portion connected to the bump pad and extending along a second direction.

    摘要翻译: 集成电路芯片包括位于半导体衬底上的最顶层金属层中的电源/接地互连网络,以及至少在电力/接地互连网络上/之上的凸块焊盘。 电源/接地网状互连网络包括连接到凸块焊盘并沿着第一方向延伸的第一电源/接地线,以及连接到凸块焊盘并沿第二方向延伸的连接部分。

    Power mesh management method
    8.
    发明授权
    Power mesh management method 有权
    电力网管理方法

    公开(公告)号:US08266568B2

    公开(公告)日:2012-09-11

    申请号:US12359911

    申请日:2009-01-26

    申请人: Chia-Lin Chuang

    发明人: Chia-Lin Chuang

    IPC分类号: G06F17/50

    摘要: The invention discloses a power mesh managing method utilized in an integrated circuit. The integrated circuit includes a standard cell and a standard-cell power supplying mesh corresponding to a first direction. The power mesh managing method includes: defining a power supplying network including a first plurality of power meshes growing along the first direction and a second plurality of power meshes growing along a second direction, and defining an assistant connecting network on a third metal layer, wherein the assistant connecting network includes a plurality of assistant connecting lines growing along the second direction, the first plurality of power meshes are formed on a first metal layer, the second plurality of power meshes on a second metal layer, the third metal layer is below the first metal layer, and the second metal layer is above the first metal layer.

    摘要翻译: 本发明公开了一种集成电路中使用的电力网管理方法。 集成电路包括对应于第一方向的标准单元和标准单元供电网。 功率网管理方法包括:定义供电网络,其包括沿着第一方向生长的第一多个电力网格和沿着第二方向生长的第二多个电力网格,以及在第三金属层上限定辅助连接网络,其中 辅助连接网络包括沿着第二方向生长的多个辅助连接线,第一多个电网形成在第一金属层上,第二多个电源在第二金属层上,第三金属层在 第一金属层,第二金属层在第一金属层的上方。

    Power layout of integrated circuits and designing method thereof
    9.
    发明授权
    Power layout of integrated circuits and designing method thereof 有权
    集成电路的电源布局及其设计方法

    公开(公告)号:US07969014B2

    公开(公告)日:2011-06-28

    申请号:US12129390

    申请日:2008-05-29

    申请人: Chia-Lin Chuang

    发明人: Chia-Lin Chuang

    IPC分类号: H01L23/48 H01L23/52 H01L29/40

    摘要: The invention discloses a technique for designing the power layout of an integrated circuit. The power layout design forms a power mesh and a power ring with a plurality of metal trunks with uniform line width. In particular, the power ring includes a plurality of metal rings, which are formed by arranging denser layout of the metal trunks with uniform line width. The power ring serves as a function of receiving and providing a power source to the elements of the integrated circuit.

    摘要翻译: 本发明公开了一种用于设计集成电路的功率布局的技术。 功率布局设计形成功率网格和具有均匀线宽的多个金属干线的功率环。 特别地,动力环包括多个金属环,其通过布置具有均匀线宽度的金属干线的更加密集的布局而形成。 功率环用作接收和提供电源到集成电路的元件的功能。

    POWER LAYOUT OF INTEGRATED CIRCUITS AND DESIGNING METHOD THEREOF
    10.
    发明申请
    POWER LAYOUT OF INTEGRATED CIRCUITS AND DESIGNING METHOD THEREOF 有权
    集成电路的功率布局及其设计方法

    公开(公告)号:US20090051040A1

    公开(公告)日:2009-02-26

    申请号:US12129390

    申请日:2008-05-29

    申请人: Chia-Lin Chuang

    发明人: Chia-Lin Chuang

    IPC分类号: H01L23/52 G06F7/50

    摘要: The invention discloses a technique for designing the power layout of an integrated circuit. The power layout design forms a power mesh and a power ring with a plurality of metal trunks with uniform line width. In particular, the power ring includes a plurality of metal rings, which are formed by arranging denser layout of the metal trunks with uniform line width. The power ring serves as a function of receiving and providing a power source to the elements of the integrated circuit.

    摘要翻译: 本发明公开了一种用于设计集成电路的功率布局的技术。 功率布局设计形成功率网格和具有均匀线宽的多个金属干线的功率环。 特别地,动力环包括多个金属环,其通过布置具有均匀线宽度的金属干线的更加密集的布局而形成。 功率环用作接收和提供电源到集成电路的元件的功能。