Invention Grant
US08669038B2 Polyimide-based polymers, copolymers thereof and positive type photoresist compositions comprising the same
有权
聚酰亚胺基聚合物，其共聚物和含有它们的正型光致抗蚀剂组合物
- Patent Title: Polyimide-based polymers, copolymers thereof and positive type photoresist compositions comprising the same
- Patent Title (中): 聚酰亚胺基聚合物，其共聚物和含有它们的正型光致抗蚀剂组合物
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Application No.: US13568911Application Date: 2012-08-07
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Publication No.: US08669038B2Publication Date: 2014-03-11
- Inventor: Chan Hyo Park , Sang Woo Kim , Kyung Jun Kim , Hye Ran Seong , Se Jin Shin , Dong Hyun Oh
- Applicant: Chan Hyo Park , Sang Woo Kim , Kyung Jun Kim , Hye Ran Seong , Se Jin Shin , Dong Hyun Oh
- Applicant Address: KR Seoul
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR Seoul
- Agency: McKenna Long & Aldridge, LLP
- Priority: KR10-2009-0020384 20090310; KR10-2010-0020703 20100309
- Main IPC: G03F7/023
- IPC: G03F7/023
Abstract:
Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings.
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