发明授权
- 专利标题： Semiconductor device and method for manufacturing the same
- 专利标题（中）： 半导体装置及其制造方法
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申请号： US13549001申请日： 2012-07-13
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公开(公告)号： US08669138B2公开(公告)日： 2014-03-11
- 发明人: Akinobu Shibuya , Koichi Takemura , Akira Ouchi , Tomoo Murakami
- 申请人： Akinobu Shibuya , Koichi Takemura , Akira Ouchi , Tomoo Murakami
- 申请人地址： JP Tokyo
- 专利权人： NEC Corporation
- 当前专利权人： NEC Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2007-052103 20070301
- 主分类号： H01L21/60
- IPC分类号： H01L21/60
摘要：
A substrate and a semiconductor chip are connected by means of flip-chip interconnection. Around connecting pads of the substrate and input/output terminals of the semiconductor chip, an underfill material is injected. The underfill material is a composite material of filler and resin. Also, a first main surface of the substrate, which is not covered with the underfill material, and the side surfaces of the semiconductor chip are encapsulated with a molding material. The molding material is a composite material of filler and resin. An integrated body of the substrate and the semiconductor chip, which are covered with the molding material, is thinned from above and below.
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