公开(公告)号：US20130012145A1

公开(公告)日：2013-01-10

申请号：US13636576

申请日：2011-03-15

申请人： Akinobu Shibuya ,  Akira Ouchi ,  Akira Miyata ,  Ryo Miyazaki ,  Yoshiaki Wakabayashi

发明人： Akinobu Shibuya ,  Akira Ouchi ,  Akira Miyata ,  Ryo Miyazaki ,  Yoshiaki Wakabayashi

IPC分类号： H04B1/38

CPC分类号： H01P5/024 ,  H01L23/48 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2223/6627 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01P3/12 ,  H05K1/0239 ,  H05K1/141 ,  H05K2201/096 ,  H05K2201/09854 ,  H05K2201/09981 ,  H01L2224/0401

摘要： Provided is a radio module that includes a radio signal connection portion having a low insertion loss and high reliability.This radio module includes a first wiring substrate 1, and a second wiring substrate 2 which is located opposite to a first face 1a of the first wiring substrate 1. Further, at least one through hole 3 having an inner wall formed of a conductive material is provided inside the second wiring substrate. Moreover, at least one hollow pillar 4 formed of a conductive material is provided at a position corresponding to the at least one through hole 3, on at least one of the first face 1a and a second face 2a of the second wiring substrate 2, the second face 2a being opposite to the first face 1a. Here, an axis-direction height of the at least one hollow pillar 4 formed of a conductive material is smaller than the width of a gap between the first face 1a and the second face 2a. Further, one end face of the at least one hollow pillar 4 formed of a conductive material is not fixed, and a radio signal passes through a hollow portion of the at least one pillar.

摘要翻译： 提供一种无线电模块，其包括具有低插入损耗和高可靠性的无线电信号连接部分。 该无线电模块包括第一布线基板1和与第一布线基板1的第一面1a相对的第二布线基板2.此外，具有由导电材料形成的内壁的至少一个通孔3是 设置在第二布线基板的内部。 此外，在与第二布线基板2的第一面1a和第二面2a中的至少一个相对应的至少一个通孔3的位置处设置由导电材料形成的至少一个中空柱4， 第二面2a与第一面1a相对。 这里，由导电材料形成的至少一个中空柱4的轴向高度小于第一面1a和第二面2a之间的间隙的宽度。 此外，由导电材料形成的至少一个中空柱4的一个端面不固定，并且无线电信号通过至少一个支柱的中空部分。

公开(公告)号：US08669138B2

公开(公告)日：2014-03-11

申请号：US13549001

申请日：2012-07-13

申请人： Akinobu Shibuya ,  Koichi Takemura ,  Akira Ouchi ,  Tomoo Murakami

发明人： Akinobu Shibuya ,  Koichi Takemura ,  Akira Ouchi ,  Tomoo Murakami

IPC分类号： H01L21/60

CPC分类号： H01L21/563 ,  H01L21/486 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83385 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/01031 ,  H01L2924/3512 ,  H01L2924/00014

摘要： A substrate and a semiconductor chip are connected by means of flip-chip interconnection. Around connecting pads of the substrate and input/output terminals of the semiconductor chip, an underfill material is injected. The underfill material is a composite material of filler and resin. Also, a first main surface of the substrate, which is not covered with the underfill material, and the side surfaces of the semiconductor chip are encapsulated with a molding material. The molding material is a composite material of filler and resin. An integrated body of the substrate and the semiconductor chip, which are covered with the molding material, is thinned from above and below.

摘要翻译： 衬底和半导体芯片通过倒装芯片互连连接。 在衬底的连接焊盘和半导体芯片的输入/输出端子之间，注入底部填充材料。 底部填充材料是填料和树脂的复合材料。 此外，未被底部填充材料覆盖的基板的第一主表面和半导体芯片的侧表面被模制材料封装。 成型材料是填料和树脂的复合材料。 由模制材料覆盖的衬底和半导体芯片的集成体从上方和下方变薄。

公开(公告)号：US08581403B2

公开(公告)日：2013-11-12

申请号：US12863941

申请日：2009-01-13

申请人： Akira Ouchi

发明人： Akira Ouchi

IPC分类号： H01L23/48

CPC分类号： H05K3/3436 ,  H01L21/32 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/81011 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/05442 ,  H01L2224/81805 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： In an electronic component mounting structure, a semiconductor element (an electronic component) provided with an electrode pad and a board provide with an electrode pad corresponding to the electrode pad are connected via a conductive material portion. On a surface of the board, there is formed solder resist having an opening regulating an area of the electrode pad. The conductive material portion is formed to protrude from a surface of the solder resist. An elastic coefficient of the conductive material portion is lower than that of the solder resist. A solder bump and the conductive material portion are connected via a metal layer. The conductive material portion is formed to have an area larger than that of the opening of the solder resist. An edge of the conductive material portion is adhered to a portion of the surface of the solder resist. Thus, in a case of mounting an electronic component on a board by flip-chip connection, a reliability of connection can be secured.

摘要翻译： 在电子部件安装结构中，设置有电极焊盘的半导体元件（电子部件）和提供与电极焊盘对应的电极焊盘的基板经由导电材料部分连接。 在板的表面上形成有阻挡电极，该阻焊层具有调节电极焊盘区域的开口。 导电材料部分形成为从阻焊剂的表面突出。 导电材料部分的弹性系数低于阻焊剂的弹性系数。 焊料凸块和导电材料部分经由金属层连接。 导电材料部分形成为具有大于阻焊剂开口面积的面积。 导电材料部分的边缘粘附到阻焊剂表面的一部分上。 因此，在通过倒装芯片连接将电子部件安装在电路板上的情况下，可以确保连接的可靠性。

公开(公告)号：US08531023B2

公开(公告)日：2013-09-10

申请号：US13383895

申请日：2010-06-25

申请人： Akinobu Shibuya ,  Akira Ouchi

发明人： Akinobu Shibuya ,  Akira Ouchi

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L21/563 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/498 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/0242 ,  H05K1/0243 ,  H05K2201/09736 ,  H05K2201/09845 ,  H05K2201/10674 ,  H01L2924/00

摘要： Disclosed is a substrate for a semiconductor package in which leakage of radiation noise from a gap between a semiconductor element and a mounting substrate can be prevented. The substrate for the semiconductor package includes a coplanar waveguide including a signal and ground electrodes on the mounting substrate, the signal electrode flip-chip connected to the semiconductor element, the ground electrodes arranged on both sides of the signal electrode with intervals therebetween. A step part is formed in the ground electrodes in an outer circumferential part of a mounting region of the semiconductor element, the step part having a larger distance between upper surfaces of the mounting substrate and the ground electrode in the outer circumferential part of the mounting region than such distance in the mounting region, and an insulator for covering the signal electrode in the outer circumferential part of the mounting region is formed.

摘要翻译： 公开了一种用于半导体封装的衬底，其中可以防止辐射噪声从半导体元件和安装衬底之间的间隙泄漏。 用于半导体封装的衬底包括共面波导，其包括安装衬底上的信号和接地电极，连接到半导体元件的信号电极倒装芯片，布置在信号电极的两侧上的接地电极，间隔。 在半导体元件的安装区域的外周部的接地电极中形成台阶部，台阶部在安装基板的上表面与安装区域的外周部的接地电极之间具有较大的距离 形成安装区域的距离，并且形成用于覆盖安装区域的外周部分中的信号电极的绝缘体。

公开(公告)号：US20100295177A1

公开(公告)日：2010-11-25

申请号：US12863941

申请日：2009-01-13

申请人： Akira Ouchi

发明人： Akira Ouchi

IPC分类号： H01L23/48 ,  H01L21/50 ,  H05K1/11

CPC分类号： H05K3/3436 ,  H01L21/32 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/81011 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/05442 ,  H01L2224/81805 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： In an electronic component mounting structure, a semiconductor element (an electronic component) provided with an electrode pad and a board provide with an electrode pad corresponding to the electrode pad are connected via a conductive material portion. On a surface of the board, there is formed solder resist having an opening regulating an area of the electrode pad. The conductive material portion is formed to protrude from a surface of the solder resist. An elastic coefficient of the conductive material portion is lower than that of the solder resist. A solder bump and the conductive material portion are connected via a metal layer. The conductive material portion is formed to have an area larger than that of the opening of the solder resist. An edge of the conductive material portion is adhered to a portion of the surface of the solder resist. Thus, in a case of mounting an electronic component on a board by flip-chip connection, a reliability of connection can be secured.

摘要翻译： 在电子部件安装结构中，设置有电极焊盘的半导体元件（电子部件）和提供与电极焊盘对应的电极焊盘的基板经由导电材料部分连接。 在板的表面上形成有阻挡电极，该阻焊层具有调节电极焊盘区域的开口。 导电材料部分形成为从阻焊剂的表面突出。 导电材料部分的弹性系数低于阻焊剂的弹性系数。 焊料凸块和导电材料部分经由金属层连接。 导电材料部分形成为具有大于阻焊剂开口面积的面积。 导电材料部分的边缘粘附到阻焊剂表面的一部分上。 因此，在通过倒装芯片连接将电子部件安装在电路板上的情况下，可以确保连接的可靠性。

公开(公告)号：US20100052163A1

公开(公告)日：2010-03-04

申请号：US12597716

申请日：2008-04-25

申请人： Akira Ouchi

发明人： Akira Ouchi

IPC分类号： H01L23/498 ,  H01L21/768

CPC分类号： H05K3/321 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49883 ,  H01L24/13 ,  H01L24/16 ,  H01L24/83 ,  H01L24/90 ,  H01L24/98 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/13019 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1517 ,  H01L2924/351 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/10984 ,  H05K2201/10992 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/3512 ,  H01L2924/00014

摘要： A semiconductor device in which opposing electrodes of a semiconductor component and of a wiring board are arranged to conduct via bumps, comprises: a first conductive resin bump provided on the electrode of the semiconductor component; and a second conductive resin bump provided on the electrode of the wiring board. The difference between a glass transition temperature of the first conductive resin bump and a glass transition temperature of the second conductive resin bump is equal to or greater than 40° C.

摘要翻译： 一种半导体器件，其中半导体部件和布线板的相对电极布置成通过凸块导电，包括：设置在半导体部件的电极上的第一导电树脂凸块; 以及设置在所述布线板的电极上的第二导电树脂凸块。 第一导电性树脂凸块的玻璃化转变温度与第二导电性树脂凸块的玻璃化转变温度的差为40℃以上。

公开(公告)号：US08802496B2

公开(公告)日：2014-08-12

申请号：US13958989

申请日：2013-08-05

申请人： Akinobu Shibuya ,  Akira Ouchi

发明人： Akinobu Shibuya ,  Akira Ouchi

IPC分类号： H01L21/56

CPC分类号： H01L21/563 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/498 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/0242 ,  H05K1/0243 ,  H05K2201/09736 ,  H05K2201/09845 ,  H05K2201/10674 ,  H01L2924/00

摘要： Disclosed is a substrate for a semiconductor package in which leakage of radiation noise from a gap between a semiconductor element and a mounting substrate can be prevented. The substrate for the semiconductor package includes a coplanar waveguide including a signal and ground electrodes on the mounting substrate, the signal electrode flip-chip connected to the semiconductor element, the ground electrodes arranged on both sides of the signal electrode with intervals therebetween. A step part is formed in the ground electrodes in an outer circumferential part of a mounting region of the semiconductor element, the step part having a larger distance between upper surfaces of the mounting substrate and the ground electrode in the outer circumferential part of the mounting region than such distance in the mounting region, and an insulator for covering the signal electrode in the outer circumferential part of the mounting region is formed.

摘要翻译： 公开了一种用于半导体封装的衬底，其中可以防止辐射噪声从半导体元件和安装衬底之间的间隙泄漏。 用于半导体封装的衬底包括共面波导，其包括安装衬底上的信号和接地电极，连接到半导体元件的信号电极倒装芯片，布置在信号电极的两侧上的接地电极，间隔。 在半导体元件的安装区域的外周部的接地电极中形成台阶部，台阶部在安装基板的上表面与安装区域的外周部的接地电极之间具有较大的距离 形成安装区域的距离，并且形成用于覆盖安装区域的外周部分中的信号电极的绝缘体。

公开(公告)号：US20130316495A1

公开(公告)日：2013-11-28

申请号：US13958989

申请日：2013-08-05

申请人： Akinobu SHIBUYA ,  Akira OUCHI

发明人： Akinobu SHIBUYA ,  Akira OUCHI

IPC分类号： H01L21/56

CPC分类号： H01L21/563 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/498 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/0242 ,  H05K1/0243 ,  H05K2201/09736 ,  H05K2201/09845 ,  H05K2201/10674 ,  H01L2924/00

摘要： Disclosed is a substrate for a semiconductor package in which leakage of radiation noise from a gap between a semiconductor element and a mounting substrate can be prevented. The substrate for the semiconductor package includes a coplanar waveguide including a signal and ground electrodes on the mounting substrate, the signal electrode flip-chip connected to the semiconductor element, the ground electrodes arranged on both sides of the signal electrode with intervals therebetween. A step part is formed in the ground electrodes in an outer circumferential part of a mounting region of the semiconductor element, the step part having a larger distance between upper surfaces of the mounting substrate and the ground electrode in the outer circumferential part of the mounting region than such distance in the mounting region, and an insulator for covering the signal electrode in the outer circumferential part of the mounting region is formed.

摘要翻译： 公开了一种用于半导体封装的衬底，其中可以防止辐射噪声从半导体元件和安装衬底之间的间隙泄漏。 用于半导体封装的衬底包括共面波导，其包括安装衬底上的信号和接地电极，连接到半导体元件的信号电极倒装芯片，布置在信号电极的两侧上的接地电极，间隔。 在半导体元件的安装区域的外周部的接地电极中形成台阶部，台阶部在安装基板的上表面与安装区域的外周部的接地电极之间具有较大的距离 形成安装区域的距离，并且形成用于覆盖安装区域的外周部分中的信号电极的绝缘体。

公开(公告)号：US20130005085A1

公开(公告)日：2013-01-03

申请号：US13549001

申请日：2012-07-13

申请人： Akinobu SHIBUYA ,  Koichi Takemura ,  Akira Ouchi ,  Tomoo Murakami

发明人： Akinobu SHIBUYA ,  Koichi Takemura ,  Akira Ouchi ,  Tomoo Murakami

IPC分类号： H01L21/60 ,  H01L21/56

CPC分类号： H01L21/563 ,  H01L21/486 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83385 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/01031 ,  H01L2924/3512 ,  H01L2924/00014

摘要： A substrate and a semiconductor chip are connected by means of flip-chip interconnection. Around connecting pads of the substrate and input/output terminals of the semiconductor chip, an underfill material is injected. The underfill material is a composite material of filler and resin. Also, a first main surface of the substrate, which is not covered with the underfill material, and the side surfaces of the semiconductor chip are encapsulated with a molding material. The molding material is a composite material of filler and resin. An integrated body of the substrate and the semiconductor chip, which are covered with the molding material, is thinned from above and below.

摘要翻译： 衬底和半导体芯片通过倒装芯片互连连接。 在衬底的连接焊盘和半导体芯片的输入/输出端子之间，注入底部填充材料。 底部填充材料是填料和树脂的复合材料。 此外，未被底部填充材料覆盖的基板的第一主表面和半导体芯片的侧表面被模制材料封装。 成型材料是填料和树脂的复合材料。 由模制材料覆盖的衬底和半导体芯片的集成体从上方和下方变薄。

公开(公告)号：US08237292B2

公开(公告)日：2012-08-07

申请号：US12526236

申请日：2008-02-29

申请人： Akinobu Shibuya ,  Koichi Takemura ,  Akira Ouchi ,  Tomoo Murakami

发明人： Akinobu Shibuya ,  Koichi Takemura ,  Akira Ouchi ,  Tomoo Murakami

IPC分类号： H01L23/488

CPC分类号： H01L21/563 ,  H01L21/486 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83385 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/01031 ,  H01L2924/3512 ,  H01L2924/00014

摘要： A substrate (1) and a semiconductor chip (5) are connected by means of flip-chip interconnection. Around connecting pads (3) of the substrate (1) and input/output terminals (10) of the semiconductor chip (5), an underfill material (7) is injected. The underfill material (7) is a composite material of filler and resin in which the maximum particle diameter of the filler is 5 μm or below and whose filler content is 40 to 60 wt %. Also, a first main surface of the substrate (1), which is not covered with the underfill material (7), and the side surfaces of the semiconductor chip (5) are encapsulated with a molding material (8). The molding material (8) is a composite material of filler and resin whose filler content is over 75 wt % and in which the glass transition temperature of the resin is over 180° C. An integrated body of the substrate (1) and the semiconductor chip (5), which are covered with the molding material (8), is thinned from above and below.

摘要翻译： 基板（1）和半导体芯片（5）通过倒装芯片互连连接。 在衬底（1）的连接焊盘（3）和半导体芯片（5）的输入/输出端子（10）之间，注入底部填充材料（7）。 底部填充材料（7）是填料和树脂的复合材料，其中填料的最大粒径为5μm以下，填料含量为40〜60重量％。 此外，未被底部填充材料（7）覆盖的基板（1）的第一主表面和半导体芯片（5）的侧表面被模制材料（8）封装。 成型材料（8）是填料和树脂的复合材料，其填料含量超过75重量％，树脂的玻璃化转变温度超过180℃。基板（1）和半导体 由模制材料（8）覆盖的芯片（5）从上方和下方变薄。