发明授权
- 专利标题： Flip-chip mounting substrate and flip-chip mounting method
- 专利标题（中）： 倒装芯片安装基板和倒装芯片安装方法
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申请号： US12478128申请日： 2009-06-04
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公开(公告)号： US08669665B2公开(公告)日： 2014-03-11
- 发明人: Yasushi Araki , Seiji Sato , Masatoshi Nakamura , Takashi Ozawa
- 申请人： Yasushi Araki , Seiji Sato , Masatoshi Nakamura , Takashi Ozawa
- 申请人地址： JP Nagano-Shi
- 专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人地址： JP Nagano-Shi
- 代理机构： Rankin, Hill & Clark LLP
- 优先权： JP2005-369714 20051222; JP2006-332444 20061208
- 主分类号： H01L23/498
- IPC分类号： H01L23/498
摘要：
A solder resist and a central pad to which a central Au bump provided on a semiconductor chip is flip-chip bonded are formed on a substrate main body. In a flip-chip mounting substrate where an underfill resin is provided after the semiconductor chip is mounted, a central opening portion for exposing the central pad is formed in the solder resist, and also, an edge portion forming the central opening portion of the solder resist is partially overlapped with the outer peripheral portion of the central pad.