发明授权
- 专利标题： Light-emitting module
- 专利标题（中）： 发光模块
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申请号： US13452752申请日： 2012-04-20
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公开(公告)号： US08672517B2公开(公告)日： 2014-03-18
- 发明人: Chia-Tin Chung , Shen-Ta Yang
- 申请人： Chia-Tin Chung , Shen-Ta Yang
- 申请人地址： TW New Taipei
- 专利权人： Paragon Semiconductor Lighting Technology Co., Ltd.
- 当前专利权人： Paragon Semiconductor Lighting Technology Co., Ltd.
- 当前专利权人地址： TW New Taipei
- 代理机构： Li & Cai Intellectual Property (USA) Office
- 优先权： TW100207227U 20110422
- 主分类号： F21V29/00
- IPC分类号： F21V29/00 ; H01L23/34
摘要：
A light-emitting module includes a heat-dissipating structure, a multichip package structure and a protection cover structure. The multichip package structure is disposed on the heat-dissipating structure, and the multichip package structure includes a substrate unit, a light-emitting unit, a frame unit and a package unit. The protection cover structure is disposed on the heat-dissipating structure to cover and protect the multichip package structure, and the protection cover structure has an opening for exposing the package unit.
公开/授权文献
- US20120268929A1 LIGHT-EMITTING MODULE 公开/授权日：2012-10-25
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