利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

56 条记录 (耗时 0.018 秒)

    Multichip package structure for directly electrically connecting to an AC power source
    1.
    发明授权
    Multichip package structure for directly electrically connecting to an AC power source 有权
    用于直接电连接到交流电源的多芯片封装结构

    公开(公告)号：US09078312B2

    公开(公告)日：2015-07-07

    申请号：US12964415

    申请日：2010-12-09

    申请人： Shih-Neng Dai ,  Chia-Tin Chung

    发明人： Shih-Neng Dai ,  Chia-Tin Chung

    IPC分类号： H05B33/08 ,  F21K99/00 ,  H01L25/16 ,  H01L25/075

    CPC分类号： H05B33/0812 ,  F21K9/00 ,  H01L25/0753 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2924/3025 ,  H05B33/0821 ,  Y02B20/348 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A multichip package structure includes a substrate unit, a light-emitting unit, a control module, a frame unit and a package unit. The substrate unit includes a first chip-placing region and a second chip-placing region. The light-emitting unit includes a plurality of light-emitting chips electrically connected to the first chip-placing region. The control module includes at least one current-limiting unit and the rectifier unit electrically connected to the second chip-placing region and the light-emitting unit. The frame unit includes a first annular colloid frame surrounding the light-emitting chips and a second annular colloid frame surrounding the current-limiting unit and the rectifier unit. The package unit includes a first package colloid body surrounded by the first annular colloid frame to cover the light-emitting chips and a second package colloid body surrounded by the second annular colloid frame to cover the current-limiting unit and the rectifier unit.

    摘要翻译： 多芯片封装结构包括基板单元，发光单元，控制模块，框架单元和封装单元。 基板单元包括第一芯片放置区域和第二芯片放置区域。 发光单元包括电连接到第一芯片放置区的多个发光芯片。 控制模块包括至少一个限流单元，并且整流单元电连接到第二芯片放置区域和发光单元。 框架单元包括围绕发光芯片的第一环形胶体框架和围绕限流单元和整流单元的第二环形胶体框架。 封装单元包括被第一环形胶体框架包围以覆盖发光芯片的第一封装胶体体和由第二环形胶体框架包围以覆盖限流单元和整流器单元的第二封装胶体体。

    LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND CONTROLLING LIGHT-PROJECTING ANGLE AND METHOD FOR MANUFACTURING THE SAME
    4.
    发明申请
    LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND CONTROLLING LIGHT-PROJECTING ANGLE AND METHOD FOR MANUFACTURING THE SAME 有权
    用于增加发光效率和控制投光角度的LED封装结构及其制造方法

    公开(公告)号：US20100327294A1

    公开(公告)日：2010-12-30

    申请号：US12550699

    申请日：2009-08-31

    申请人： CHIA-TIN CHUNG ,  CHAO-CHIN WU ,  FANG-KUEI WU

    发明人： CHIA-TIN CHUNG ,  CHAO-CHIN WU ,  FANG-KUEI WU

    IPC分类号： H01L33/00 ,  H01L21/50

    CPC分类号： H01L25/0753 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： An LED package structure for increasing light-emitting efficiency and controlling light-projecting angle includes a substrate unit, a light-emitting unit, a light-reflecting unit and a package unit. The substrate unit has a substrate body and a chip-placing area disposed on a top surface of the substrate body. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the top surface of the substrate body by coating. The annular reflecting resin body surrounds the LED chips that are disposed on the chip-placing area to form a resin position limiting space above the chip-placing area. The package unit has a translucent package resin body disposed on the top surface of the substrate body in order to cover the LED chips. The position of the translucent package resin body is limited in the resin position limiting space.

    摘要翻译： 用于提高发光效率和控制投光角度的LED封装结构包括基板单元，发光单元，光反射单元和封装单元。 基板单元具有设置在基板主体的上表面上的基板主体和芯片放置区域。 发光单元具有多个LED芯片，电芯设置在芯片放置区域上。 光反射单元具有通过涂覆在基板主体的上表面上周围形成的环状的反射树脂体。 环状反射树脂体围绕设置在芯片放置区域上的LED芯片，以在芯片放置区域上方形成树脂位置限制空间。 封装单元具有设置在基板主体的顶表面上的半透明封装树脂体，以覆盖LED芯片。 半透明封装树脂体的位置限制在树脂位置限制空间中。

    Plastic substrate, fabrication method thereof and device using the same
    5.
    发明授权
    Plastic substrate, fabrication method thereof and device using the same 有权
    塑料基板及其制造方法及使用其的装置

    公开(公告)号：US07053546B2

    公开(公告)日：2006-05-30

    申请号：US10633666

    申请日：2003-08-04

    申请人： Chen-Ze Hu ,  Chia-Tin Chung ,  Ruey-Min Chen ,  Yao-Hui Lee

    发明人： Chen-Ze Hu ,  Chia-Tin Chung ,  Ruey-Min Chen ,  Yao-Hui Lee

    IPC分类号： H01L51/50 ,  H05B33/00

    CPC分类号： C23C16/30 ,  H01L51/0097 ,  H01L51/5253 ,  H01L2251/5338 ,  Y02E10/549

    摘要： A plastic substrate for OLED, fabrication method thereof and device using the substrate. The OLED comprises a plastic substrate with a deposition film of predetermined thickness formed thereon by plasma CVD. The deposition film has the formula SiOeCaHbXcYdZf (e≦2, 2−e=a+b+c+d+f), wherein X, Y and Z are periodic table IA, IIA, IIIA, IVA, VA, VIA or VIIA elements excepting H. X, Y and Z also can be selected from the group consisting of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Pd, Ag, Pt and Au. The OLED with the plastic substrate has both glass and plastic properties, including high temperature tolerance, good gas and liquid resistance, superior planarity, and high transparency and high flexibility.

    摘要翻译： 一种用于OLED的塑料基板，其制造方法和使用该基板的装置。 OLED包括通过等离子体CVD在其上形成有预定厚度的沉积膜的塑料基板。 沉积膜具有以下分子式：SiO 2 C 1 H 2 C （e <= 2，2-e = a + b + c + d + f）其中X，Y和Z是周期表IA，IIA，IIIA，IVA，VA， 除了H. X，Y和Z之外的VIA或VIIA元素也可以选自Sc，Ti，V，Cr，Mn，Fe，Co，Ni，Cu，Zn，Pd，Ag，Pt和Au。 具有塑料基板的OLED具有玻璃和塑料性能，包括耐高温，气体和液体阻力好，平面性优异，透明度高，灵活性高。

    Display device with a lenticular lens and the method of making the same
    6.
    发明申请
    Display device with a lenticular lens and the method of making the same 审中-公开
    具有双凸透镜的显示装置及其制造方法

    公开(公告)号：US20050133804A1

    公开(公告)日：2005-06-23

    申请号：US10998772

    申请日：2004-11-29

    申请人： Chun-Che Hsu ,  Hong-Ru Gou ,  Chia-Tin Chung

    发明人： Chun-Che Hsu ,  Hong-Ru Gou ,  Chia-Tin Chung

    IPC分类号： H05B33/02 ,  G09F9/00 ,  H01L27/32 ,  H01L51/50 ,  H01L51/52 ,  H05B33/04 ,  H05B33/14 ,  H01L33/00

    CPC分类号： H01L51/5275 ,  H01L27/3211 ,  H01L51/524

    摘要： The present invention relates to a display device comprising a substrate, a display module, a lenticular lens and a glass cap. The display module is attached to the substrate and is used for emitting light. The lenticular lens is disposed above the display module and is used for changing the luminous intensity distribution of the light emitted by the display module. The glass cap is disposed above the lenticular lens and is sealed with the substrate for capping the lenticular lens and the display module. According to the display device of the invention, the disunity of the luminous intensity distribution of the light emitted by the display module in different view angles is improved, which facilitates the color control. The present invention also relates to a method of making a display device with a lenticular lens.

    摘要翻译： 显示装置技术领域本发明涉及包括基板，显示模块，双凸透镜和玻璃盖的显示装置。 显示模块附着在基板上，用于发光。 双凸透镜设置在显示模块上方，用于改变由显示模块发射的光的发光强度分布。 玻璃盖设置在双凸透镜上方，并用基板密封以封闭双凸透镜和显示模块。 根据本发明的显示装置，提高了显示模块以不同的视角发出的光的发光强度分布的不均匀性，这有利于颜色控制。 本发明还涉及制造具有双凸透镜的显示装置的方法。

    Method of sealing organo electro-luminescent display
    7.
    发明授权
    Method of sealing organo electro-luminescent display 有权
    有机电致发光显示器的密封方法

    公开(公告)号：US06872114B2

    公开(公告)日：2005-03-29

    申请号：US10760862

    申请日：2004-01-20

    申请人： Chia-Tin Chung ,  Hao Jung Huang ,  Chen Wei Huang

    发明人： Chia-Tin Chung ,  Hao Jung Huang ,  Chen Wei Huang

    IPC分类号： H01L51/52 ,  H01J9/00

    CPC分类号： H01L51/5253 ,  H01L51/5246 ,  H01L2251/5315

    摘要： A top-emission organic electro-luminescent display (OLED) has a substrate with at least a anode layer, an organic fluorescent film, at least a cathode layer, a barrier layer and a protection layer. A transparent sealing structure is glued to the top of the substrate. Wherein, the transparent sealing structure has an adhesion layer glued to the protection layer, a plurality of organic resin layers formed on the adhesion layer, a plurality of inorganic barrier layers disposed between the organic resin layers, a flexible polymer film formed on the organic resin layer, and a hard coat formed on the flexible polymer film.

    摘要翻译： 顶部发射有机电致发光显示器（OLED）具有至少具有阳极层，有机荧光膜，至少阴极层，势垒层和保护层的衬底。 透明的密封结构粘合到基底的顶部。 其中，透明密封结构具有胶合到保护层的粘附层，在粘合层上形成的多个有机树脂层，设置在有机树脂层之间的多个无机阻挡层，形成在有机树脂上的柔性聚合物膜 层和在柔性聚合物膜上形成的硬涂层。

    Method of manufacturing organic electroluminescent element
    8.
    发明授权
    Method of manufacturing organic electroluminescent element 有权
    制造有机电致发光元件的方法

    公开(公告)号：US06860778B2

    公开(公告)日：2005-03-01

    申请号：US10656099

    申请日：2003-09-05

    申请人： Chia-Tin Chung ,  Mao-Jung Chung ,  Yao-Hui Lee ,  Hong-Ru Guo

    发明人： Chia-Tin Chung ,  Mao-Jung Chung ,  Yao-Hui Lee ,  Hong-Ru Guo

    IPC分类号： H05B33/10 ,  H01L27/32 ,  H01L51/00 ,  H01L51/40 ,  H01L51/50 ,  H01J9/24

    CPC分类号： H01L27/3239 ,  H01L51/0003

    摘要： A structure and a method of manufacturing the organic electroluminescent (EL) elements, patterns of icons on the display panel of organic EL elements are formed. Initially, ramparts are formed on a continuous surface of a transparent and conductive film, i.e. an indium-tin oxide (ITO) film, and ramparts determine patterns of icons, then organic function layers and electrodes are formed. Processes are compatible to a conventional method of manufacturing an array type display panel, to improve disadvantages of dividing processes of array type display panels and organic EL elements into two portions.

    摘要翻译： 形成有机电致发光（EL）元件的结构和方法，形成有机EL元件的显示面板上的图标的图形。 首先，在透明导电膜，即氧化铟锡（ITO）膜的连续表面上形成壁垒，并且确定图案的图案，然后形成有机功能层和电极。 方法与制造阵列型显示面板的常规方法兼容，以改善将阵列型显示面板和有机EL元件的分割过程分成两部分的缺点。

    LED package structure with concave area for positioning heat-conducting substance
    10.
    发明授权
    LED package structure with concave area for positioning heat-conducting substance 有权
    LED封装结构具有凹面积，用于定位导热物质

    公开(公告)号：US09029883B2

    公开(公告)日：2015-05-12

    申请号：US13180298

    申请日：2011-07-11

    申请人： Chia-Tin Chung

    发明人： Chia-Tin Chung

    IPC分类号： H01L33/00 ,  F21K99/00 ,  H01L25/075 ,  H01L33/64

    CPC分类号： F21K9/00 ,  H01L25/0753 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0075 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An LED package structure with concave area for positioning heat-conducting substance includes a substrate unit, a heat-conducting adhesive unit, a light-emitting unit, a conductive unit and a package unit. The substrate unit has a substrate body, a concave space formed on the substrate body, and a plurality of positive and negative pads exposed on the substrate body. The heat-conducting adhesive unit has a heat-conducting adhesive layer positioned in the concave space. The light-emitting unit has a plurality of LED chips disposed on the heat-conducting adhesive layer and received in the concave space. The conductive unit has a plurality of wires. Each LED chip is electrically connected between each positive pad and each negative pad. The package unit has a translucent package resin body disposed on the substrate body in order to cover the LED chips and the wires.

    摘要翻译： 具有用于定位导热物质的凹面积的LED封装结构包括基板单元，导热粘合单元，发光单元，导电单元和封装单元。 基板单元具有基板主体，形成在基板主体上的凹形空间，以及暴露在基板主体上的多个正极和负极焊盘。 导热粘合单元具有定位在凹形空间中的导热粘合剂层。 发光单元具有设置在导热粘合剂层上并被容纳在凹形空间中的多个LED芯片。 导电单元具有多根导线。 每个LED芯片电连接在每个正极焊盘和每个负焊盘之间。 封装单元具有设置在基板主体上的半透明封装树脂体，以覆盖LED芯片和电线。