Invention Grant
US08673793B2 Method for automatic offset calculation for deposition of an aligned metal pattern onto selective emitter pattern and subsequent monitoring of alignment
失效
用于自动偏移计算的方法，用于将对准的金属图案沉积到选择性发射器图案上并随后监视对准
- Patent Title: Method for automatic offset calculation for deposition of an aligned metal pattern onto selective emitter pattern and subsequent monitoring of alignment
- Patent Title (中): 用于自动偏移计算的方法，用于将对准的金属图案沉积到选择性发射器图案上并随后监视对准
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Application No.: US13358131Application Date: 2012-01-25
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Publication No.: US08673793B2Publication Date: 2014-03-18
- Inventor: Andreas Meisel
- Applicant: Andreas Meisel
- Assignee: Innovalight Inc
- Current Assignee: Innovalight Inc
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/469
Abstract:
A method for calculating an offset value for aligned deposition of a second pattern onto a first pattern, comprising steps of: (a) loading a substrate with the first pattern on a surface of the substrate into a pattern recognition device at an original position inside the pattern recognition device; (b) determining a coordinate of a prescribed point of the first pattern by the pattern recognition device; (c) superimposing the second pattern onto the first pattern on the surface of the substrate; (d) bringing back the substrate with the first pattern and the second pattern into the original position inside the pattern recognition device; (e) determining a coordinate of a prescribed point of the second pattern by the pattern recognition device; wherein the prescribed point of the first pattern corresponds to the prescribed point of the second pattern; and (f) calculating the offset value between the first pattern and the second pattern.
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