Invention Grant
- Patent Title: Seal ring structures with reduced moisture-induced reliability degradation
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Application No.: US13007927Application Date: 2011-01-17
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Publication No.: US08674508B2Publication Date: 2014-03-18
- Inventor: Chien-Jung Wang , Jian-Hong Lin
- Applicant: Chien-Jung Wang , Jian-Hong Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A semiconductor chip includes a seal ring adjacent to edges of the semiconductor chip; an opening extending from a top surface to a bottom surface of the seal ring, wherein the opening has a first end on an outer side of the seal ring and a second end on an inner side of the seal ring; and a moisture barrier having a sidewall parallel to a nearest side of the seal ring, wherein the moisture barrier is adjacent the seal ring and has a portion facing the opening.
Public/Granted literature
- US20110108945A1 Seal Ring Structures with Reduced Moisture-Induced Reliability Degradation Public/Granted day:2011-05-12
Information query
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