Invention Grant
- Patent Title: Flip-chip type light-emitting device with curved reflective layer
- Patent Title (中): 倒装式发光装置,具有弯曲反射层
-
Application No.: US13326697Application Date: 2011-12-15
-
Publication No.: US08674594B2Publication Date: 2014-03-18
- Inventor: Tae-Geun Kim , Wan-Ho Lee
- Applicant: Tae-Geun Kim , Wan-Ho Lee
- Applicant Address: KR Seoul
- Assignee: Korea University Industrial & Academic Collaboration Foundation
- Current Assignee: Korea University Industrial & Academic Collaboration Foundation
- Current Assignee Address: KR Seoul
- Agency: IPLA P.A.
- Agent James E. Bame
- Priority: KR10-2008-0046383 20080520
- Main IPC: F21V7/00
- IPC: F21V7/00 ; H01J1/62 ; H01L33/00

Abstract:
A light-emitting device comprises a substrate; a light-emitting layer formed on the substrate; a transparent electrode layer formed on the light-emitting layer, the transparent electrode layer having a curved surface; and a reflective layer formed on and along the curved surface of the transparent electrode layer such that the curved surface of the transparent electrode layer is transferred so as to reflect the light generated from the light-emitting layer toward the light-emitting layer.
Public/Granted literature
- US20120086037A1 LIGHT-EMITTING DEVICE Public/Granted day:2012-04-12
Information query