发明授权
- 专利标题: Flip-chip type light-emitting device with curved reflective layer
- 专利标题(中): 倒装式发光装置,具有弯曲反射层
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申请号: US13326697申请日: 2011-12-15
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公开(公告)号: US08674594B2公开(公告)日: 2014-03-18
- 发明人: Tae-Geun Kim , Wan-Ho Lee
- 申请人: Tae-Geun Kim , Wan-Ho Lee
- 申请人地址: KR Seoul
- 专利权人: Korea University Industrial & Academic Collaboration Foundation
- 当前专利权人: Korea University Industrial & Academic Collaboration Foundation
- 当前专利权人地址: KR Seoul
- 代理机构: IPLA P.A.
- 代理商 James E. Bame
- 优先权: KR10-2008-0046383 20080520
- 主分类号: F21V7/00
- IPC分类号: F21V7/00 ; H01J1/62 ; H01L33/00
摘要:
A light-emitting device comprises a substrate; a light-emitting layer formed on the substrate; a transparent electrode layer formed on the light-emitting layer, the transparent electrode layer having a curved surface; and a reflective layer formed on and along the curved surface of the transparent electrode layer such that the curved surface of the transparent electrode layer is transferred so as to reflect the light generated from the light-emitting layer toward the light-emitting layer.
公开/授权文献
- US20120086037A1 LIGHT-EMITTING DEVICE 公开/授权日:2012-04-12
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