发明授权
- 专利标题： Filler module for computing devices
- 专利标题（中）： 计算设备的填充模块
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申请号： US12945359申请日： 2010-11-12
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公开(公告)号： US08677043B2公开(公告)日： 2014-03-18
- 发明人: David T. Windell , Jeffrey J. Smith , Timothy A. Meserth , Seth D. Lewis
- 申请人： David T. Windell , Jeffrey J. Smith , Timothy A. Meserth , Seth D. Lewis
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Suiter Swantz pc llo
- 主分类号： H05K7/10
- IPC分类号： H05K7/10 ; G06F13/40
摘要：
An A filler module may include, but is not limited to: a body portion; and at least one conductive portion receivable within a component port of a computing device.A method for initializing a computing system may include but is not limited to: detecting a presence or absence of one or more filler modules within one or more computing device component ports; and determining compliance with an allowed filler module configuration according to the detection of the presence or absence of the one or more filler modules withing the one or more computing device component ports.A system comprising: a computing device component port; and a processing device configured to: detect a presence or absence of one or more filler modules within one or more computing device component ports, and determine compliance with an allowed filler module configuration according to the detection of the presence or absence of the one or more filler modules within the one or more computing device component ports.
公开/授权文献
- US20120120588A1 DETECTION OF FILLER MODULE PRESENCE 公开/授权日：2012-05-17
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