发明授权
US08679922B2 Method of producing semiconductor device and method of producing solid-state image pickup device
有权
制造半导体器件的方法和制造固态图像拾取器件的方法
- 专利标题： Method of producing semiconductor device and method of producing solid-state image pickup device
- 专利标题（中）： 制造半导体器件的方法和制造固态图像拾取器件的方法
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申请号： US13360456申请日： 2012-01-27
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公开(公告)号： US08679922B2公开(公告)日： 2014-03-25
- 发明人: Takaharu Kondo , Takashi Usui
- 申请人： Takaharu Kondo , Takashi Usui
- 申请人地址： JP Tokyo
- 专利权人： Canon Kabushiki Kaisha
- 当前专利权人： Canon Kabushiki Kaisha
- 当前专利权人地址： JP Tokyo
- 代理机构： Canon USA, Inc. IP Division
- 优先权： JP2011-026348 20110209
- 主分类号： H01L21/336
- IPC分类号： H01L21/336
摘要：
The method includes a step of forming a mask having an opening, for forming an opening in multiple insulating films, above a semiconductor substrate on which a member becoming a first insulating film, a member becoming a second insulating film being different from the member becoming the first insulating film, a member becoming a third insulating film, and a member becoming a fourth insulating film being different from the member becoming the third insulating film are stacked in this order; a first step of continuously removing the member becoming the fourth insulating film and the member becoming the third insulating film at a portion corresponding to the opening of the mask; and a second step of removing the member becoming the second insulating film, after the first step, at a portion corresponding to the opening of the mask.