Disclosed is a light-emitting diode structure comprises a substrate, a plurality of light-emitting diodes on the substrate, and a conductive layer laid on the surface thereof. Each light-emitting diode comprises at least an electrical coupling side close to another electrical coupling side of an adjacent light-emitting diode. Each light-emitting diode comprises at least a first and a second electrode on the surface along the electrical coupling side, so that two close first or second electrodes can be soldered at the same time in wire soldering process, so as to make the light-emitting diodes connect in parallel. One end of the conductive layer is connected to the first electrode of a light-emitting diode and the other end is close to the second electrode of another light-emitting diode, so that the second electrode and the conductive layer can be soldered at the same time in wire soldering process, so as to make the light-emitting diodes connect in series.