发明授权
- 专利标题： Packages with passive devices and methods of forming the same
- 专利标题（中）： 带无源器件的封装及其形成方法
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申请号： US13464081申请日： 2012-05-04
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公开(公告)号： US08680647B2公开(公告)日： 2014-03-25
- 发明人: Chen-Hua Yu , Shang-Yun Hou , Der-Chyang Yeh , Shuo-Mao Chen , Chiung-Han Yeh , Yi-Jou Lin
- 申请人： Chen-Hua Yu , Shang-Yun Hou , Der-Chyang Yeh , Shuo-Mao Chen , Chiung-Han Yeh , Yi-Jou Lin
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/498 ; H01L23/538 ; H01L23/64
摘要：
A device includes a substrate, a metal pad over the substrate, and a passivation layer having a portion over the metal pad. A Post-Passivation Interconnect (PPI) line is disposed over the passivation layer and electrically coupled to the metal pad. An Under-Bump Metallurgy (UBM) is disposed over and electrically coupled to the PPI line. A passive device includes a portion at a same level as the UBM. The portion of the passive device is formed of a same material as the UBM.