Invention Grant
- Patent Title: Cover structure with integrated chip and antenna
- Patent Title (中): 封装结构，集成芯片和天线
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Application No.: US13626932Application Date: 2012-09-26
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Publication No.: US08684273B2Publication Date: 2014-04-01
- Inventor: Peter Scherl , Frank Pueschner , Juergen Hoegerl
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102011115166 20110927
- Main IPC: G06K19/06
- IPC: G06K19/06
Abstract:
In various embodiments, a cover structure for a personal identification document is provided. The cover structure may include a cover formed as a single layer; a chip module; the cover having a recess for completely receiving the chip module; and an antenna that is connected to the chip module.
Public/Granted literature
- US20130075478A1 COVER STRUCTURE WITH INTEGRATED CHIP AND ANTENNA Public/Granted day:2013-03-28
Information query
