公开(公告)号：US20230021853A1

公开(公告)日：2023-01-26

申请号：US17866777

申请日：2022-07-18

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Peter Stampka ,  Jens Pohl ,  Uwe Wagner ,  Thomas Spoettl

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  B42D25/305

Abstract: A method for producing a document structure, wherein the method includes producing a chip structure by forming a cavity in a carrier having a top side and an under side, picking up a chip having at least one chip contact and a redistribution layer (RDL) connected to the at least one chip contact by means of a picking-up device detaching the chip from an auxiliary carrier, wherein the chip bears on the auxiliary carrier by way of the RDL, wherein the chip is lifted up from the auxiliary carrier by means of pressure being exerted on the RDL, wherein the lifted-up chip is picked up and inserted into the cavity, and wherein the RDL is oriented on the top side of the carrier, fixing the chip in the cavity by means of an adhesive, electrically conductively connecting the at least one chip contact of the RDL to an electrically conductive region of the carrier by means of an electrically conductive material, and embedding the carrier between a first paper layer and a second paper layer.

公开(公告)号：US10423870B2

公开(公告)日：2019-09-24

申请号：US14710689

申请日：2015-05-13

Applicant: Infineon Technologies AG

Inventor： Martin Buchsbaum ,  Josef Gruber ,  Juergen Hoelzl ,  Frank Pueschner ,  Peter Stampka

IPC: H01Q1/50 ,  G06K19/073 ,  H01Q7/08 ,  H01Q1/22 ,  H03H7/38 ,  H04B1/40 ,  H04B5/00

Abstract: Various embodiments provide a communication module having a carrier, a loop antenna, a modulation circuit which is coupled to the loop antenna and is configured to modulate or demodulate signals which are received or transmitted using the loop antenna, and an impedance matching circuit for matching the impedance of the loop antenna to the input impedance of the modulation circuit. The modulation circuit and the impedance matching circuit are arranged inside the loop antenna on or in the carrier.

公开(公告)号：US10380477B2

公开(公告)日：2019-08-13

申请号：US15406832

申请日：2017-01-16

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Peter Stampka ,  Siegfried Hoffner ,  Jens Pohl

IPC: G06K19/00 ,  G06K19/077

Abstract: A chip card is provided. The chip card may include a chip card substrate and an antenna structure disposed in or over the chip card substrate, the antenna structure including a wire arranged to form a first antenna portion configured to contactlessly couple to a chip card external device and a second antenna portion configured to couple to a chip antenna, wherein the wire may include an electrically conductive material coated with an electrically insulating material, wherein the wire of the first antenna portion may be arranged such that a direction of laying progress of the wire of at least some adjacent wire portions are opposite to each other, such that the at least some adjacent wire portions may form a capacitor, wherein the isolation material of the at least some adjacent wire portions may be physically contacting each other.

公开(公告)号：US09935042B2

公开(公告)日：2018-04-03

申请号：US15609136

申请日：2017-05-31

Applicant: Infineon Technologies AG

Inventor： Thomas Spoettl ,  Frank Pueschner ,  Guenther Ruhl ,  Peter Stampka

IPC: H01L23/48 ,  H01L23/498 ,  H01L25/065 ,  H01L23/367 ,  H01L23/495 ,  G06K19/07 ,  G06K19/077 ,  H05K1/11 ,  H01L23/00 ,  H01L23/34

CPC classification number: H01L23/498 ,  G06K19/072 ,  G06K19/07309 ,  G06K19/077 ,  H01L23/34 ,  H01L23/3675 ,  H01L23/49537 ,  H01L23/573 ,  H01L24/73 ,  H01L25/0657 ,  H05K1/113

Abstract: A semiconductor package includes a chip, a layer which is thermally coupled to the chip and which is formed from a material having a triggering temperature of greater than or equal to 200° C., starting from which an exothermic reaction takes place, and encapsulating material which at least partly covers the chip and the layer. The layer is configured in such a way and is arranged relative to the chip in such a way that, in the case of a triggered exothermic reaction of the material of the layer, at least one component of the chip is damaged on account of the temperature increase caused by the exothermic reaction.

公开(公告)号：US20170345740A1

公开(公告)日：2017-11-30

申请号：US15609136

申请日：2017-05-31

Applicant: Infineon Technologies AG

Inventor： Thomas Spoettl ,  Frank Pueschner ,  Guenther Ruhl ,  Peter Stampka

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/00 ,  H01L23/495 ,  H01L23/367 ,  H01L23/34 ,  G06K19/077 ,  H05K1/11 ,  G06K19/07

CPC classification number: H01L23/498 ,  G06K19/072 ,  G06K19/07309 ,  G06K19/077 ,  H01L23/34 ,  H01L23/3675 ,  H01L23/49537 ,  H01L23/573 ,  H01L24/73 ,  H01L25/0657 ,  H05K1/113

Abstract: A semiconductor package includes a chip, a layer which is thermally coupled to the chip and which is formed from a material having a triggering temperature of greater than or equal to 200° C., starting from which an exothermic reaction takes place, and encapsulating material which at least partly covers the chip and the layer. The layer is configured in such a way and is arranged relative to the chip in such a way that, in the case of a triggered exothermic reaction of the material of the layer, at least one component of the chip is damaged on account of the temperature increase caused by the exothermic reaction.

公开(公告)号：US09384437B2

公开(公告)日：2016-07-05

申请号：US14697664

申请日：2015-04-28

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Thomas Spoettl ,  Jens Pohl ,  Gottfried Beer

IPC: G06K19/06 ,  G06K19/077 ,  G06K19/07 ,  H01L25/00 ,  H01L23/488 ,  H01L21/48

CPC classification number: G06K19/07705 ,  G06K19/0716 ,  G06K19/077 ,  G06K19/07749 ,  G06K19/07754 ,  H01L21/48 ,  H01L23/488 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/16238

Abstract: In various embodiments, a smart card module is provided. The smart card module includes a carrier having a first main surface and a second main surface opposite the first main surface. The carrier has at least one plated-through hole. The smart card module further includes a contact array arranged above the first main surface of the carrier and having a plurality of electrical contacts. At least one electrical contact of the plurality of electrical contacts is electrically connected to the plated-through hole. The smart card module further includes a chip arranged above the second main surface. The chip is electrically coupled to at least one electrical contact of the plurality of electrical contacts by the plated-through hole. The smart card module further includes at least one optoelectronic component arranged above the second main surface and electrically conductively connected to the chip.

公开(公告)号：US09070067B2

公开(公告)日：2015-06-30

申请号：US14292270

申请日：2014-05-30

Applicant: Infineon Technologies AG

Inventor： Juergen Hoegerl ,  Andreas Mueller-Hipper ,  Frank Pueschner ,  Wolfgang Schindler ,  Peter Stampka

IPC: G06K19/06 ,  G06K19/077 ,  H01L23/00

CPC classification number: G06K19/07743 ,  G06K19/07728 ,  G06K19/07745 ,  H01L23/16 ,  H01L23/293 ,  H01L24/16 ,  H01L24/83 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/014

Abstract: A smart card module for use in a smart card includes a microchip and a contact zone for making contact with the microchip by means of a reader. The microchip can be enclosed by an encapsulation which can enclose the microchip completely from all sides.

Abstract translation: 用于智能卡的智能卡模块包括微芯片和用于通过读取器与微芯片接触的接触区域。 微芯片可以通过封装，其可以从所有侧面完全包围微芯片。

公开(公告)号：US08684273B2

公开(公告)日：2014-04-01

申请号：US13626932

申请日：2012-09-26

Applicant: Infineon Technologies AG

Inventor： Peter Scherl ,  Frank Pueschner ,  Juergen Hoegerl

IPC: G06K19/06

CPC classification number: G06K19/025 ,  G06K19/07749

Abstract: In various embodiments, a cover structure for a personal identification document is provided. The cover structure may include a cover formed as a single layer; a chip module; the cover having a recess for completely receiving the chip module; and an antenna that is connected to the chip module.

Abstract translation: 在各种实施例中，提供了用于个人识别文件的盖结构。 盖结构可以包括形成为单层的盖; 芯片模块; 所述盖具有用于完全接收所述芯片模块的凹部; 以及连接到芯片模块的天线。

公开(公告)号：US20220366204A1

公开(公告)日：2022-11-17

申请号：US17742873

申请日：2022-05-12

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Jens Pohl ,  Peter Stampka

IPC: G06K19/07

Abstract: A chip card biometric sensor component having a carrier, a biometric sensor arranged on or in the carrier, a control logic, which is arranged on or in the carrier and is coupled to the biometric sensor, and at least one light-emitter, which is arranged on or in the carrier or in an opening of the carrier and is connected to the control logic and is controllable by the latter.

公开(公告)号：USD967036S1

公开(公告)日：2022-10-18

申请号：US29729221

申请日：2020-03-25

Applicant: Infineon Technologies AG

Designer： Roman Hollweck ,  Thomas Lehmann ,  Jens Pohl ,  Frank Pueschner ,  Thomas Spoettl