Invention Grant
US08685201B2 Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing
有权
用于在半导体加工期间减少柔性基板的翘曲和弯曲的组件和方法
- Patent Title: Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing
- Patent Title (中): 用于在半导体加工期间减少柔性基板的翘曲和弯曲的组件和方法
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Application No.: US12921896Application Date: 2009-04-06
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Publication No.: US08685201B2Publication Date: 2014-04-01
- Inventor: Shawn O'Rourke , Douglas Loy , Hanqing Jiang
- Applicant: Shawn O'Rourke , Douglas Loy , Hanqing Jiang
- Applicant Address: US AZ Scottsdale
- Assignee: Arizona Board of Regents, a body corporate of the State of Arizona, Acting for and on Behalf of Arizona State University
- Current Assignee: Arizona Board of Regents, a body corporate of the State of Arizona, Acting for and on Behalf of Arizona State University
- Current Assignee Address: US AZ Scottsdale
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- International Application: PCT/US2009/039577 WO 20090406
- International Announcement: WO2009/126544 WO 20091015
- Main IPC: B32B7/12
- IPC: B32B7/12 ; C09J7/02 ; C09J4/00 ; C09J101/00 ; C09J201/00 ; B32B27/00 ; B32B27/38
Abstract:
Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein.
Public/Granted literature
- US20110064953A1 Assemblies and Methods for Reducing Warp and Bow of a Flexible Substrate During Semiconductor Processing Public/Granted day:2011-03-17
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